The Global Aluminum Silicon Carbide (AlSiC) market was valued at USD 63,419.5 thousand in 2019 and is projected to reach USD 100,444.7 thousand by 2027, expanding at a CAGR of 7.2% during the forecast period. In terms of volume, the market is projected to expand at a CAGR of 5.6% during the forecast period. AlSiC (Aluminum Silicon Carbide) is a compound material which combines silicon carbide elements in an aluminum alloy matrix. AlSiC has high thermal conductivity, lightweight, and controlled thermal expansion. It offers superior thermal management for high technology electronic applications in a cost-effective, lightweight materials. AlSiC is widely used in microelectronics as a substrate for high-density multi-chip modules and power semiconductor devices, where it helps eliminate waste heat. The low material density of AlSiC makes it preferred choice for weight-sensitive applications such as space-borne, portable devices, and airborne. AlSiC is widely used owing to its superior properties such as environmental resistance, lightweight, superior mechanical properties, low thermal expansion, excellent mechanical damping, and high thermal conductivity. Moreover, its cost is comparatively lower than other metal products, and thus it is used in various industries such as aerospace, electrical & electronics, and automotive & transportation.
The supreme AlSiC material properties along with concurrent integration and net-shape fabrication possess cost-effective manufacturing and it offers high-performance thermal management, resulting in functional packaging designs. Net-shape is the ability to fabricate materials and package geometry without finish machining and concurrent integration that excludes the requirement for subsequent soldering and brazing, which decreases the total packaging cost. Increasing demand for microelectronics and electronic packaging material and system for thermal management, functionality, and weight requirements is resulting in cost-effective solutions for processing technologies to provide high-performance packaging.
Rising demand for AlSiC in aerospace application due to the increasing demand for airplanes and passenger traffic is driving the global market. AlSiC is used for producing aerospace parts such as airplane wings, as the material has outstanding property and is lighter in weight than aluminum alloy. Thus, aluminum alloy is replaced with AlSiC. In the defense and military sector, AlSiC properties such as lightweight, superior mechanical capabilities, low thermal expansion, and environmental resistance make it a preferred material for manufacturing defense and military vehicles, armor, and aircraft body. This, in turn, is driving the market. Furthermore, AlSiC has high thermal conductivity; therefore, its demand is high from the electronics industry, thus propelling the growth of the market.
AlSiC has lower density than traditional metal components, which makes it a suitable material for convenient electronics such as space-based applications and laptops. Additionally, its thermal properties increase its usage for optoelectronic and electronic application packaging. AlSiC packaging is produced at a lower price than the traditional packaging material, and thus the former is expected to replace the latter, thereby creating lucrative opportunities in the aluminum silicon carbide (AlSiC) market.
High processing costs of the methods (excluding casting), technological difficulties regarding the machining of composites after preparation, and availability of low-cost reinforcement are expected to restraint the global aluminum silicon carbide (AlSiC) market.
By composition, the aluminum silicon carbide (AlSiC) market has been segmented into Al70/SiC30, Al50/SiC50, Al40/SiC60, Al60/SiC40, and others. The Al60/SiC40 segment is expected to hold a significant share of the market and is projected to expand at a considerable CAGR during the forecast period. AlSiC is used as an advanced packaging material for high technology thermal management. It is compatible with a wide range of metallic and ceramic substrate and plating materials used in microelectronic packaging for aerospace, automotive, microwave applications.
By production process, the aluminum silicon carbide (AlSiC) market has been segmented into liquid metal infiltration, powder metallurgy, casting, and deposition techniques. The casting segment is expected to constitute a substantial share of the market and is anticipated to expand at a considerable CAGR during the forecast period. Casting is a widely accepted process for the production of AlSiC, as it offers several advantages and is a cost-effective process. Moreover, replacement of old production techniques with new technologies for the production of AlSiC is expected to create lucrative opportunities in the market.
By application, the aluminum silicon carbide (AlSiC) market has been segmented into aerospace & defense, automotive, machined components, electronics & semiconductors, and others. The electronics & semiconductors segment is expected to hold considerable share of the market and is projected to expand at a high CAGR during the forecast period, owing to the increasing application of AlSiC in electronic packaging. This, in turn, is propelling the electronics & semiconductors segment. Moreover, increasing demand for electronic and microelectronics packaging systems and materials due to its properties such as less weight, and high thermal management. These requirements have encouraged the growth of processing technologies and new materials to offer cost-effective high performance packaging solutions. AlSiC composite packages offer unique material properties that are ideally suitable for the above-mentioned requirements.
In terms of regions, the global aluminum silicon carbide (AlSiC)s market is fragmented into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. North America is expected to account for highest share of the market and is projected to expand at a considerable CAGR during the forecast period. Rising application of AlSiC in the electronic & semiconductor industry and the aerospace industry is expected to propel the market in the region. The market in Asia Pacific is anticipated to expand at highest CAGR during the forecast period, owing to the presence of players in the region. Moreover, rising demand for AlSiC in various industries such as aerospace & defense, electronics, machine components, and automotive is expected to boost the market in the region.
Some frequently asked quetions about this report!
Additional company profiles can be provided on request.
Yes, the report covers product specific information such as liquid metal infiltration, powder, metallurgy, casting, and deposition techniques.
According to the Growth Market Reports report, the market from aluminum silicon carbide (AlSiC) is likely to register a CAGR of 7.2% during forecast period 2020-2027, with an anticipated valuation of USD 100,444.73 thousand by the end of the 2027.
The global aluminum silicon carbide (AlSiC) market report provides the additional data such as overview of metal matrix composites market and information related to the development of cost-effective manufacturing processes for aluminum silicon carbide.
The market is driven by factors such as affordable production of aluminum silicon carbide electronic packages, rising use of aluminum silicon carbide for various applications, and beneficial properties of AlSiC material.
Factors such as competitive strength and market positioning are key areas considered while selecting top companies to be profiled.
The market is expected to witness a decline of 2.1% in 2020 as compared to 2019 owing to the negative impact of COVID-19.
The base year considered for the global aluminum silicon carbide (AlSiC) market report is 2019. The complete analysis period is 2017 to 2027, wherein, 2017 & 2018 are the historic years and the forecast is provided from 2020 to 2027.
The companies operating in the aerospace & defense, automotive, machined components, electronics & semiconductors industry are the key end users driving the market growth.
Major Manufactures include Denka Company Limited, CPS Technologies Corp., Ferrotec (USA) Corporation, Materion Corporation, and DWA Aluminum Composites USA, Inc. among others.
Some other reports from this category!