The advanced packaging market size is projected to register a substantial CAGR during the forecast period, 2021–2028. The growth of the market is attributed to the rising need for miniaturization of devices and enhanced system performances.
Advanced packaging has changed semiconductor production methods and brought up a new paradigm in chip design. Foundries have benefited more and more from the automation of sophisticated packaging processes, which has been aided by expanding electronic design automation projects. Advanced packaging is being developed to suit the different circumstances of power dissipation, field operation, and most significantly cost. The need for high-performance semiconductors in a variety of consumer devices has fuelled the growth of the advanced packaging industry. Furthermore, advancements in panel-level fan-out technologies have created new opportunities in the advanced packaging sector.
The Covid-19 pandemic affected the demand and supply of advanced packaging market. Lockdown across the globe, supply chain disorders, and oscillating supply of raw materials forced manufacturers to shut down production leading to unfortunate decline in market growth. Launch of vaccines to combat the Covid-19 pandemic is expected to contribute to the market growth over the forecast period.
Market Trends, Drivers, Restraints, and Opportunities
- Rising need for miniaturization of devices is projected to fuel the market during the forecast period.
- Enhanced system performances are key factor is propelling the market.
- High price of advanced packaging is estimated to hamper the market growth.
- Lack of awareness act as major challenges that can restrict the market in the coming years.
- R&D investment and technological advancement is anticipated to create lucrative opportunities for the market players.
Scope of the Report
The report on the advanced packaging market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.
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Attributes
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Details
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Report Title
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Advanced Packaging Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast
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Base Year
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2020
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Historic Data
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2018–2019
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Forecast Period
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2021–2028
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Segmentation
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Packaging Platform (Flip Chip, Embedded Die, Fi-WLP, Fo-WLP)
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Geographical Scope
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Asia Pacific, North America, Latin America, Europe, and Middle East & Africa
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Report Coverage
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Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast
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Key Players Covered in the Report
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Samsung Electronics Co., Ltd; Amkor Technology, Inc.; Taiwan Semiconductor Manufacturing Company, Limited; Advanced Semiconductor Engineering Inc.; Intel Corporation
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Market Segment Insights
The fan-out wafer level packaging segment is projected to represent a major market share
In terms of packaging platform, the advanced packaging market is segregated into flip chip, embedded die, Fi-WLP, Fo-WLP. The Fo-WLP segment is expected to represent a key share of the market during the forecast period. Fo-WLP is considered as a promising solution for meeting growing needs for consumer electronics. Key characteristics such as substrate-less packaging, low thermal resistance, and high performance due to short interconnects combined with direct IC connection via thin-film metallization rather than wire bonds or flip-chip bumps, as well as more moderate parasitic effects, are estimated to drive the market. Large substrate formats are being targeted with the aid of FOWLP as a result of numerous technical advancements toward heterogeneous integration, such as multiple die packaging, passive component integration in packages and redistribution layers, and other package-on-package methods. The technique of FOWLP is being viewed as a viable alternative to 2.5D packaging. In contrast to WLCSP technology, which can only accommodate a single die, fan-out can manage many dies.
Asia-Pacific is expected to dominate the market
On the basis of geography, the advanced packaging market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. Asia-Pacific is anticipated to dominate the market during the forecast period. Major semiconductor manufacturing businesses that have been operating in the region for a long time are fuelling the demand for sophisticated semiconductor packaging. Semiconductor firms in the Asia-Pacific are effectively managing cost challenges and maintaining better profitability by emphasizing improvements in end-to-end yield. Furthermore, China is one of the world's fastest-growing economies, with a big population, and according to figures from China's semiconductor association, IC import demand has been increasing from the past four years. The Chinese government has implemented a multi-pronged plan to promote the growth of the local semiconductor sector in order to accomplish the objective of being the world leader in all main semiconductors industrial supply chain segments during forecast period. This increase in the region's semiconductor IC sector is expected to boost demand for advanced packaging.
Segments
Segments Covered in the Report
The advanced packaging market has been segmented on the basis of
Packaging Platform
- Flip Chip
- Embedded Die
- Fi-WLP
- Fo-WLP
Geography
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
Key Players
Competitive Landscape
Key players competing in the Advanced Packaging market include Samsung Electronics Co., Ltd, Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company, Limited, Advanced Semiconductor Engineering Inc., and Intel Corporation.
Some of these players are using several market strategies such as mergers, acquisitions, partnerships, collaborations, capacity expansion, and product launches to increase their market shares.
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