The global copper clad laminates market size was USD 16.4 Bn in 2022 and is likely to reach USD 27.01 Bn by 2031, expanding at a CAGR of 5.7% during 2023–2031. Rising usage in the fabrication of electronic circuit boards is likely to propel the market.
Copper-clad laminates are a type of material that is used in printed circuit boards in which either one or both sides are laminated with copper. It provides high thermal conductivity and high-frequency operation in the circuit boards.
Digital transformation is imperative for businesses to maximize returns and create value throughout business operations. Digital transformation is characterized by advancements in semiconductor manufacturing technologies, electronic chip manufacturing processes, and improvements in electronic printed circuit board (PCB) design techniques.
The electronic printed circuit board comprises various electronic components interconnected with the help of conducive planes, copper traces, and pads laminated onto a non-conductive base. It provides mechanical support and connects the electronic components on insulating substrates.
Copper-clad laminates are widely used in telecommunication equipment as a foundation for printed circuit boards as it manages heat and improve signal transmission when current flows through the boards. Furthermore, it is used in vehicle electronics, communication systems, healthcare devices, consumer appliances, defense technology, and computers.
The COVID-19 pandemic disrupted the overall supply chain of the market, as the government imposed an emergency lockdown and several restrictions including social distancing and traveling restrictions to control the outage of the virus. This in turn adversely affected manufacturing units. Furthermore, a sharp decline in demand for copper clad laminates from end-users, due to the lack of timely supply of raw materials decreased the market growth during the pandemic.
Copper Clad Laminates Market Dynamics
Major Drivers
Growing expansion of 5G telecom infrastructure is expected to drive the market. The 5G telecom network is expanding to reach out to customers in every corner of the world. Copper-clad laminates are widely used in printed circuit boards used in telecommunication devices. The copper-clad laminates help in heat management, moisture control, and signal transmission enhancement. Rising disposable income of individuals leads to an increase in the sales of various electronic products such as mobile phones, tablets, laptops, and computers in which copper-clad laminates are used for heat management characteristics, which further boosts the market.
Existing Restraints
Increasing costs of raw materials such as copper foil may restrain the market growth. However, supply chain disruption due to market variations and geopolitical unrest is likely to hinder the market.
Emerging Opportunities
The automotive industry is going through a major transformation in terms of enhancing safety, and cost-efficiency. The technological advancements and subsequent integration of electronic and digital systems in vehicles are likely to create lucrative opportunities in the market. The electronic and digital systems in the vehicles use copper-clad laminates in the circuit boards for heat management and high strength.
Scope of the Copper Clad Laminates Market Report
The market report includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.
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Attributes
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Details
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Report Title
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Copper Clad Laminates Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast
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Base Year
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2022
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Historic Data
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2016–2021
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Forecast Period
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2023–2031
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Segmentation
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Resin Type (Phenolic, Epoxy, and Polyimide), Product Type (Flexible and Rigid), Reinforcement Material Type (Paper Base, Glass Fiber, and Compound Materials), and Application (Vehicle Electronics, Healthcare Devices, Computers, Communication Systems, and Consumer Appliances)
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Regional Scope
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Asia Pacific, North America, Latin America, Europe, and Middle East & Africa
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Report Coverage
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Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, Market Trends, and Revenue Forecast
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Key Players Covered in the Report
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Doosan Corporation; Panasonic Holdings Corporation; Cipel Italia S.r.l.; Shandong Jinbao Electrical Co. Ltd.; Taiwan Union Technology Corporation; Isola Group B.V.; SYTECH International Co., Ltd.; GRACE ELECTRON; and Kblaminates
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Market Segment Insights
Based on resin type, the market is divided into phenolic, epoxy, and polyimide. The epoxy segment is expected to expand at a significant growth rate during the projection period, owing to its outstanding heat management characteristics, dielectric qualities, and mechanical strength. The epoxy is used as an insulating base for various electrical motors, machines, generators, and electrical appliances. Thus, rising usage as an electrically insulating material is likely to boost the segment.
On the basis of product type, the global market is bifurcated into flexible and rigid. The flexible segment is projected to register a considerable CAGR during the assessment period, due to the low melting point, high strength, heat resistance, and good moisture resistance offered by the flexible copper-clad laminates. The layers of flexible copper-clad laminates are made up of polyester film or PI film as substrate material. These copper-clad laminates are used in electronic products such as automotive GPS, cell phones, laptops, and digital cameras.
On the basis of reinforcement material type, the copper clad laminates market is segregated into paper base, glass fiber, and compound materials. The glass fiber segment is expected to register a robust growth rate during the forecast period, owing to its good moisture resistance, electrical properties, high strength, and heat resistance. Fiberglass is mostly used in electronic systems that need energy optimization.
On the basis of application, the market is segmented into vehicle electronics, healthcare devices, computers, communication systems, and consumer appliances. The vehicle electronics segment is projected to grow at a high CAGR in the coming years, due to the rising usage of electrical systems in vehicles to enhance security and flexibility. Copper-clad laminates are integrated into collision avoidance, driver assistance, and emergency braking systems for heat management purposes.
In terms of region, the global copper clad laminates market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. Asia Pacific is expected to dominate the market during the projection period, owing to the increasing adoption of electric vehicles and electronic devices. The electronics market in the Asia Pacific region has multifold in the last decade, due to the high economic growth rate, low costs of raw materials, and wide availability of raw materials. Moreover, the rapid expansion of the automotive and electronics industries in developing countries is likely to accelerate the market.
Segments
The copper clad laminates market has been segmented on the basis of
Resin Type
Product Type
Reinforcement Material Type
- Paper Base
- Glass Fiber
- Compound Materials
Application
- Vehicle Electronics
- Healthcare Devices
- Computers
- Communication Systems
- Consumer Appliances
Region
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
Key Players
- Doosan Corporation
- Panasonic Holdings Corporation
- Cipel Italia S.r.l.
- Shandong Jinbao Electrical Co. Ltd.
- Taiwan Union Technology Corporation
- Isola Group B.V.
- SYTECH International Co., Ltd.
- GRACE ELECTRON
- Kblaminates
Competitive Landscape
Key players competing in the global copper clad laminates market are Doosan Corporation; Panasonic Holdings Corporation; Cipel Italia S.r.l.; Shandong Jinbao Electrical Co. Ltd.; Taiwan Union Technology Corporation; Isola Group B.V.; SYTECH International Co., Ltd.; GRACE ELECTRON; and Kblaminates.
These companies adopted several strategies including partnerships, mergers, collaboration, acquisitions, and product launches to cater to the customer worldwide. For instance,
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In January 2022, Panasonic Holdings Corporation developed MEGTRON 8 multi-layer circuit board materials that are based on copper-clad laminates. The MEGTRON 8 is specially designed for high-speed communication networking equipment including switches and routers. It features low transmission loss with improved speed and frequency in telecommunication networks.
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