SiC CMP Pads & Slurry Market Share, Industry Analysis [2031]

Report Description

SiC CMP Pads & Slurry Market Outlook 2031:

The Global SiC CMP Pads & Slurry Market was valued at USD 56.4 Million in 2022 and is expected to reach USD 115.6 Million in 2031, expanding at a CAGR of 8.4% during the forecast period.

CMP Pads are made up of porous material with filler materials to achieve the hardness to polish the wafer surface. This hardness is considered as a crucial factor as it affects the material removal rate (MRR) and uniformity of the wafer. When CMP pads undergo mechanical processes, their physical properties such as elasticity, hardness, and surface roughness are expected to change during CMP.

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CMP Slurry is a stable liquid that contains materials such as Potassium Persulphate, Hydrogen Peroxide, Potassium Permanganate, and Potassium Chlorate show oxidizing properties. The material with a higher rate of oxidation has a higher material removal rate (MRR).

The Global SiC CMP Pads & Slurry Market is slightly impacted by Covid-19, due to the disruption in the supply chain and limitations in the cross broader transactions. The supply chain was disrupted in the initial stage of the lockdown, which declined the manufacturing of SiC CMP Pads & Slurry.

SiC CMP Pads & Slurry Market Dynamics

Driver: Increasing Adoption of SiC Wafers

Silicon carbide (SiC) is an alternative to silicon-based electronics components, especially in wide bandgap Application. The material offers a unique combination of high-power efficiency, small size, lightweight, and low overall cost of the systems.

Semiconductors made with SiC process electricity more efficiently than traditional Si-based semiconductors in some important applications such as 5G technology, power electronics, and electric vehicles. SiC semiconductors improve battery performance and increase the range of electric vehicles while saving energy. SiC semiconductors have registered an increased demand, propelling the demand for SiC CMP Pads.

Driver: Trends of Miniaturization in Semiconductor Devices

Chemical Mechanical Planarization (CMP) is a key enabling technology to generate extremely flat and smooth surfaces at several critical steps in the semiconductor manufacturing process. The process is critical in manufacturing small semiconductor components. Miniaturization in electronic devices involves a number of transistor nodes on a small integrated circuit (IC).

The IC is then interfaced within its intended system or device to carry out the desired function. The trend of miniaturization is driven by the increasing demand for portable electronic devices, which, in turn, increases the demand for consumables used in the manufacturing process such as CMP slurries.

Restraint: High Machining Cost of SiC Wafers

SiC is well known for its hardness, brittleness, and inertness. However, the current CMP process of SiC suffers from high machining costs and low throughput.

SiC CMP pads are quite expensive than traditional CMP pads, due to the complexities that occur during the manufacturing process and the need for high-quality materials. This creates difficulties for semiconductor manufacturers to adopt SiC technology, which further restrains the market.

Opportunity: Growing Demand for SiC Power Devices

Silicon Carbide (SiC) power devices offer several advantages over traditional silicon (Si) power devices. SiC-based wafer designs require high upfront investments. However, they offer energy efficiency, smaller system size and high reliability.

SiC’s properties enable designers to develop small devices that run cooler, switch faster and operate at higher voltages. SiC-based power devices support higher power density, which translates to high power delivery in smaller package. This is important for Application such as EVs and renewable energy systems.

 Scope of SiC CMP Pads & Slurry Market Report

The report on the Global SiC CMP Pads & Slurry Market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.

SiC CMP Pads & Slurry Market Segmental Outlook

The Global SiC CMP Pads & Slurry Market is segmented on the basis of Type, Application, and regions.

By Type

Based on Type, the global SiC CMP Pads & Slurry Market is segmented into SiC CMP Pads and SiC CMP Slurry. The SiC CMP Pads segment held XX% value share of the market in 2022, and is expected to expand at XX% CAGR between 2023 and 2031.

SiC CMP Pads are Polyurethane (Polyester Urethane) pads impregnated with nanoparticles such as ferrous and Aluminum oxide in order to planarize the surface of the silicon carbide wafers. SiC (silicon carbide) is a compound semiconductor composed of silicon and carbide. These devices have high operating voltages, high operating frequency, and higher dependability, compared to Si-based devices.

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By Application

Based on Application, the global SiC CMP Pads & Slurry Market is segmented into Power Electronics, RF Electronics, LEDs, and Others. The Power Electronics segment held XX% value share of the market in 2022, and is expected to expand at XX% CAGR between 2023 and 2031.

Power electronics are devices that deal with the processing, control, and conversion of electric power. It involves the use of solid-state electronics, such as transistors and diodes, to control and manipulate high-power electrical energy. SiC is a semiconductor material with a high electric breakdown field and saturated electron velocity, which makes them suitable for use in power electronics.

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Regional Outlook

On the basis of region, the global SiC CMP Pads & Slurry Market is segmented into North America, Europe, Asia Pacific, Latin America, and the Middle East & and Africa (MEA). In North America, the market expand at a CAGR of XX% between 2022 and 2031.

North America region is witnessing increasing prevalence of research & development in semiconductor industries, due to the growing popularity of its application in electronic sector leading to high adoption of SiC wafers. In Europe, the market in Europe is anticipated to expand at a CAGR of XX% between 2023 and 2031.

The market growth is attributed to increased demand for electric mobility from consumers and technological benefits offering by the SiC wafers such as thermal conductivity & ability to operate under harsh conditions. In Asia Pacific, the market in Asia Pacific is anticipated to expand at a CAGR of XX% between 2023 and 2031.

Rising growth in semiconductor manufacturing industries. The countries such as Taiwan, South Korea, China, Japan are rapidly contributing the popularity of the pads & slurries market in Asia Pacific is driving the market in the region.

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Key Benefits for Industry Participants & Stakeholders

• In-depth Analysis of the Global SiC CMP Pads & Slurry Market

• Historical, Current, and Projected Market Size in terms of Value and Volume

• Potential & Niche Segments and Regions Exhibiting Promising Growth Covered

• Industry Drivers, Restraints, and Opportunities Covered in the Study

• Recent Industry Trends and Developments

• Competitive Landscape & Strategies of Key Players

• Neutral Perspective on Global SiC CMP Pads & Slurry Market Performance