Global Vertical Furnace Market By Type (Wafer Size: up to 150mm, Wafer Size: 151mm – 200mm and Wafer Size: 201mm – 300mm), By Method (LPCVD, PECVD, Thermal Oxidation, and Others) By Application (Advanced Packaging, Semiconductor, and Others), and Region (North America, Latin America, Europe, Asia Pacific, and Middle East & Africa)
Market Outlook:
The global vertical furnace market was valued at USD 4,224.2 Million in 2019 and is projected to reach USD 6,586.3 Million by 2027, expanding at a CAGR of 5.4% during the forecast period. Booming consumer products and electronics sector in several developed economies such as China and Japan have resulted in the expansion of the semiconductor industry, which is in turn, boosting the growth of the vertical furnace market. Furthermore, developments in technology for improving the thickness uniformity are creating opportunities in the global vertical furnace market. Vertical furnaces provide a much higher performance, as compared to horizontal furnaces, in terms of temperature uniformity and cleanroom footprint. Moreover, they provide improved wafer handling by moving carrier up rather than using long (transversally loaded) cantilevers, making it suitable for advanced manufacturing of semiconductors and advanced packaging.
Market Dynamics
The demand for vertical furnaces is rising as they are used for advanced packaging, which are used for improving the device performance, high demand for semiconductor products, and growth in application of vertical furnaces are the major factors boosting the market. Conversely, high cost of products, and unaffordable price for small enterprise in the semiconductor are expected to restrain the growth of market. Rise in R&D investments and developments in wafer size at decreasing costs are anticipated to create lucrative opportunities in the market.
Segmental Outlook
Based on types, the market has been segmented into wafer sizes: up to 150mm, wafer size: 151mm – 200mm, and wafer size: 201mm – 300mm. The wafer size: 201mm – 300mm segment dominated the overall market in 2019 with share of 69.4%. The large share of the segment is attributed to the high demand for several IC products, which are made from semiconductors such as flash memories, power management devices, and image sensors, which are built on furnaces with 300mm wafers.
On the basis of methods, the market is segregated into LPCVD, PECVD, thermal oxidation, and others. The LPCVD segment is estimated to expand at a CAGR of 5.8% during the forecast period. The growth of the segment is attributed to its high usage due to its various attributes such as high purity, thickness uniformity, and superior reliability.
By Type
Trends
The wafer size: 201mm – 300mm segment holds a significant share in the market and is projected to grow at a substantial pace during the forecast period owing to its ability to aid a large number of device manufacture in a single batch. This also helps reduce the overall cost/unit as compared to other wafer sizes. Moreover, high demand for IC products such as CPUs, GPUs, DRAM, NAND flash, power management devices, image sensors, and other high-volume technologies are typically built on 300mm wafers, which ultimately results in the growth of the segment. Regardless of its diminishing demand and short-term outlook, it is expected that vertical furnace 151mm – 200mm wafers will still remain viable during the forecast period as all wafer-based products do not require advanced nodes, which are provided by wafer size: 201mm – 300mm. However, depletion in the supply of and use of refurbished wafer size: 151mm – 200mm is anticipated to limit the growth of the segment. OEMs are manufacturing new 200mm equipment, which integrate 300mm technology to mitigate supply constraints.
By Application
Definitions
Advanced Packaging: Advanced packaging is a common classification of a number of distinct technologies including 2.5D, 3D-IC, wafer-level fan-out packaging, and system-in packaging. Advanced packages such as fan-out and those introduced through silicon vias (TSVs) have become core packaging platforms that effectively address the latest trends. These types of advanced packaging techniques provide the requisite modularization and convergence to allow higher output levels at the system level, offering greater bandwidth, and provide efficient power management. In advanced packaging, vertical furnaces are used for providing high yield anneals for e-WLB and thermal processes for interposer TSV. Moreover, it provides wet thermal oxide for Si through liner with high conformity and oxide integrity, controlled film shrinkage, and bowing. Vertical furnaces help with low-temperature metal anneals with strong sheet resistance (Rs), low CoO, and low O2 atmosphere, which prevents Al or Cu oxidation.
Semiconductors: Semiconductors are materials that provide conductivity between conductors (usually metals) and non-conductors or insulators (such as most ceramics). Semiconductors can be pure elements, such as silicon or germanium, or derivatives such as gallium arsenide or cadmium selenide. Small amounts of impurities are applied to pure semiconductors in a doping process, which causes drastic changes in material conductivity. Vertical furnaces for annealing and thin film formation are broadly used in the manufacturing semiconductor devices, as it provides exemplary temperature distribution, and atmosphere control.
Regional Outlook
On the basis of regions, the market is classified as North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. The demand for vertical furnaces in North America is projected to expand at a CAGR of 5.3% during the forecast period owing to the large investments in high-end products such as wearables, IoT devices, and advanced computing devices. These premium products require advanced packaging on semiconductor which increases the cost of the final products. the demand for these premium products is increasing in the region, which in turn is expanding the demand for vertical furnaces in the region.
The demand for the vertical furnace in Europe is projected to expand at a substantial CAGR during the forecast period. The market in this region is driven by the presence of several automotive manufacturers that use automotive semiconductors such as sensors, processors, and power devices. These semiconductors are also used for the production of vehicles; therefore, the rise in the demand for automotive semiconductors is expected to boost the vertical furnace market in the region.
Competitive Landscape
- Key players in the global vertical furnace market includes ASM International, Centrotherm international AG, Koyo Thermo Systems Co., Ltd., Tempress, Tokyo Electron Limited, and Kokusai Electric Corporation. These companies are considered as key manufacturers of vertical furnace, based on their revenue, research & development activities, regional presence, and supply chain management system.
- The players are adopting key strategies such as acquisition, and geographical expansion where potential opportunity for the Vertical Furnace extraction is added in the company’s capacity.
- In July 2019, Kokusai Electric Corporation expand its collaboration with Grenoble’s Substrate Innovation Center (France) associated with Soitec (Euronext Paris), a leading designer and manufacturer of innovative semiconductor materials for R&D activities.
- In April 2019, Centrotherm International AG introduced new system generation for PECVD and LPCVD processes and solar cell concepts with passivated contacts which is intended to enable solar cell manufacturers to achieve further significant increases in efficiency.
- On January 2019, Koyo Thermo Systems Co., Ltd updated the VF-3000 Low Cost Mini Batch Vertical Furnace with features such as a low temperature LGO heater, optimized the heat efficiency, and heat dissipation balance of the operating temperature range insulation, and manufactured and conducted a heater prototype.
- In July 2017, ASM International launched Intrepid ES(TM) 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications.
Key Benefits for Industry Participants & Stakeholders
- In-depth Analysis of the Global Vertical Furnace Market
- Historical, Current and Projected Market Size in terms of Value
- Potential & Niche Segments and Regions Exhibiting Promising Growth Covered
- Industry Drivers, Restraints and Opportunities Covered in the Study
- Recent Industry Trends and Developments
- Competitive Landscape & Strategies of Key Players
- Neutral Perspective on Global Vertical Furnace Market Performance
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 Vertical Furnace Market Overview
4.1 Introduction
4.1.1 Market Taxonomy
4.1.2 Market Definition
4.1.3 Macro-Economic Factors Impacting the Market Growth
4.2 Vertical Furnace Market Dynamics
4.2.1 Market Drivers
4.2.2 Market Restraints
4.2.3 Market Opportunity
4.3 Vertical Furnace Market - Supply Chain Analysis
4.3.1 List of Key Suppliers
4.3.2 List of Key Distributors
4.3.3 List of Key Consumers
4.4 Key Forces Shaping the Vertical Furnace Market
4.4.1 Bargaining Power of Suppliers
4.4.2 Bargaining Power of Buyers
4.4.3 Threat of Substitution
4.4.4 Threat of New Entrants
4.4.5 Competitive Rivalry
4.5 Global Vertical Furnace Market Size & Forecast, 2017-2027
4.5.1 Vertical Furnace Market Size and Y-o-Y Growth
4.5.2 Vertical Furnace Market Absolute $ Opportunity
Chapter 5 Global Vertical Furnace Market Analysis and Forecast By Type
5.1 Introduction
5.1.1 Key Market Trends & Growth Opportunities By Type
5.1.2 Basis Point Share (BPS) Analysis By Type
5.1.3 Absolute $ Opportunity Assessment By Type
5.2 Vertical Furnace Market Size Forecast By Type
5.2.1 Wafer Size: up to 150mm
5.2.2 Wafer Size: 151mm – 200mm
5.2.3 Wafer Size: 201mm – 300mm
5.3 Market Attractiveness Analysis By Type
Chapter 6 Global Vertical Furnace Market Analysis and Forecast By Method
6.1 Introduction
6.1.1 Key Market Trends & Growth Opportunities By Method
6.1.2 Basis Point Share (BPS) Analysis By Method
6.1.3 Absolute $ Opportunity Assessment By Method
6.2 Vertical Furnace Market Size Forecast By Method
6.2.1 LPCVD
6.2.2 PECVD
6.2.3 Thermal Oxidation
6.2.4 Others
6.3 Market Attractiveness Analysis By Method
Chapter 7 Global Vertical Furnace Market Analysis and Forecast By Application
7.1 Introduction
7.1.1 Key Market Trends & Growth Opportunities By Application
7.1.2 Basis Point Share (BPS) Analysis By Application
7.1.3 Absolute $ Opportunity Assessment By Application
7.2 Vertical Furnace Market Size Forecast By Application
7.2.1 Advanced Packaging
7.2.2 Semiconductor
7.2.3 Others
7.3 Market Attractiveness Analysis By Application
Chapter 8 Global Vertical Furnace Market Analysis and Forecast by Region
8.1 Introduction
8.1.1 Key Market Trends & Growth Opportunities by Region
8.1.2 Basis Point Share (BPS) Analysis by Region
8.1.3 Absolute $ Opportunity Assessment by Region
8.2 Vertical Furnace Market Size Forecast by Region
8.2.1 North America
8.2.2 Europe
8.2.3 Asia Pacific
8.2.4 Latin America
8.2.5 Middle East & Africa (MEA)
8.3 Market Attractiveness Analysis by Region
Chapter 9 Coronavirus Disease (COVID-19) Impact
9.1 Introduction
9.2 Current & Future Impact Analysis
9.3 Economic Impact Analysis
9.4 Government Policies
9.5 Investment Scenario
Chapter 10 North America Vertical Furnace Analysis and Forecast
10.1 Introduction
10.2 North America Vertical Furnace Market Size Forecast by Country
10.2.1 U.S.
10.2.2 Canada
10.3 Basis Point Share (BPS) Analysis by Country
10.4 Absolute $ Opportunity Assessment by Country
10.5 Market Attractiveness Analysis by Country
10.6 North America Vertical Furnace Market Size Forecast By Type
10.6.1 Wafer Size: up to 150mm
10.6.2 Wafer Size: 151mm – 200mm
10.6.3 Wafer Size: 201mm – 300mm
10.7 Basis Point Share (BPS) Analysis By Type
10.8 Absolute $ Opportunity Assessment By Type
10.9 Market Attractiveness Analysis By Type
10.10 North America Vertical Furnace Market Size Forecast By Method
10.10.1 LPCVD
10.10.2 PECVD
10.10.3 Thermal Oxidation
10.10.4 Others
10.11 Basis Point Share (BPS) Analysis By Method
10.12 Absolute $ Opportunity Assessment By Method
10.13 Market Attractiveness Analysis By Method
10.14 North America Vertical Furnace Market Size Forecast By Application
10.14.1 Advanced Packaging
10.14.2 Semiconductor
10.14.3 Others
10.15 Basis Point Share (BPS) Analysis By Application
10.16 Absolute $ Opportunity Assessment By Application
10.17 Market Attractiveness Analysis By Application
Chapter 11 Europe Vertical Furnace Analysis and Forecast
11.1 Introduction
11.2 Europe Vertical Furnace Market Size Forecast by Country
11.2.1 Germany
11.2.2 France
11.2.3 Italy
11.2.4 U.K.
11.2.5 Spain
11.2.6 Russia
11.2.7 Rest of Europe
11.3 Basis Point Share (BPS) Analysis by Country
11.4 Absolute $ Opportunity Assessment by Country
11.5 Market Attractiveness Analysis by Country
11.6 Europe Vertical Furnace Market Size Forecast By Type
11.6.1 Wafer Size: up to 150mm
11.6.2 Wafer Size: 151mm – 200mm
11.6.3 Wafer Size: 201mm – 300mm
11.7 Basis Point Share (BPS) Analysis By Type
11.8 Absolute $ Opportunity Assessment By Type
11.9 Market Attractiveness Analysis By Type
11.10 Europe Vertical Furnace Market Size Forecast By Method
11.10.1 LPCVD
11.10.2 PECVD
11.10.3 Thermal Oxidation
11.10.4 Others
11.11 Basis Point Share (BPS) Analysis By Method
11.12 Absolute $ Opportunity Assessment By Method
11.13 Market Attractiveness Analysis By Method
11.14 Europe Vertical Furnace Market Size Forecast By Application
11.14.1 Advanced Packaging
11.14.2 Semiconductor
11.14.3 Others
11.15 Basis Point Share (BPS) Analysis By Application
11.16 Absolute $ Opportunity Assessment By Application
11.17 Market Attractiveness Analysis By Application
Chapter 12 Asia Pacific Vertical Furnace Analysis and Forecast
12.1 Introduction
12.2 Asia Pacific Vertical Furnace Market Size Forecast by Country
12.2.1 China
12.2.2 Japan
12.2.3 South Korea
12.2.4 India
12.2.5 Australia
12.2.6 South East Asia (SEA)
12.2.7 Rest of Asia Pacific (APAC)
12.3 Basis Point Share (BPS) Analysis by Country
12.4 Absolute $ Opportunity Assessment by Country
12.5 Market Attractiveness Analysis by Country
12.6 Asia Pacific Vertical Furnace Market Size Forecast By Type
12.6.1 Wafer Size: up to 150mm
12.6.2 Wafer Size: 151mm – 200mm
12.6.3 Wafer Size: 201mm – 300mm
12.7 Basis Point Share (BPS) Analysis By Type
12.8 Absolute $ Opportunity Assessment By Type
12.9 Market Attractiveness Analysis By Type
12.10 Asia Pacific Vertical Furnace Market Size Forecast By Method
12.10.1 LPCVD
12.10.2 PECVD
12.10.3 Thermal Oxidation
12.10.4 Others
12.11 Basis Point Share (BPS) Analysis By Method
12.12 Absolute $ Opportunity Assessment By Method
12.13 Market Attractiveness Analysis By Method
12.14 Asia Pacific Vertical Furnace Market Size Forecast By Application
12.14.1 Advanced Packaging
12.14.2 Semiconductor
12.14.3 Others
12.15 Basis Point Share (BPS) Analysis By Application
12.16 Absolute $ Opportunity Assessment By Application
12.17 Market Attractiveness Analysis By Application
Chapter 13 Latin America Vertical Furnace Analysis and Forecast
13.1 Introduction
13.2 Latin America Vertical Furnace Market Size Forecast by Country
13.2.1 Brazil
13.2.2 Mexico
13.2.3 Rest of Latin America (LATAM)
13.3 Basis Point Share (BPS) Analysis by Country
13.4 Absolute $ Opportunity Assessment by Country
13.5 Market Attractiveness Analysis by Country
13.6 Latin America Vertical Furnace Market Size Forecast By Type
13.6.1 Wafer Size: up to 150mm
13.6.2 Wafer Size: 151mm – 200mm
13.6.3 Wafer Size: 201mm – 300mm
13.7 Basis Point Share (BPS) Analysis By Type
13.8 Absolute $ Opportunity Assessment By Type
13.9 Market Attractiveness Analysis By Type
13.10 Latin America Vertical Furnace Market Size Forecast By Method
13.10.1 LPCVD
13.10.2 PECVD
13.10.3 Thermal Oxidation
13.10.4 Others
13.11 Basis Point Share (BPS) Analysis By Method
13.12 Absolute $ Opportunity Assessment By Method
13.13 Market Attractiveness Analysis By Method
13.14 Latin America Vertical Furnace Market Size Forecast By Application
13.14.1 Advanced Packaging
13.14.2 Semiconductor
13.14.3 Others
13.15 Basis Point Share (BPS) Analysis By Application
13.16 Absolute $ Opportunity Assessment By Application
13.17 Market Attractiveness Analysis By Application
Chapter 14 Middle East & Africa (MEA) Vertical Furnace Analysis and Forecast
14.1 Introduction
14.2 Middle East & Africa (MEA) Vertical Furnace Market Size Forecast by Country
14.2.1 Saudi Arabia
14.2.2 South Africa
14.2.3 UAE
14.2.4 Rest of Middle East & Africa (MEA)
14.3 Basis Point Share (BPS) Analysis by Country
14.4 Absolute $ Opportunity Assessment by Country
14.5 Market Attractiveness Analysis by Country
14.6 Middle East & Africa (MEA) Vertical Furnace Market Size Forecast By Type
14.6.1 Wafer Size: up to 150mm
14.6.2 Wafer Size: 151mm – 200mm
14.6.3 Wafer Size: 201mm – 300mm
14.7 Basis Point Share (BPS) Analysis By Type
14.8 Absolute $ Opportunity Assessment By Type
14.9 Market Attractiveness Analysis By Type
14.10 Middle East & Africa (MEA) Vertical Furnace Market Size Forecast By Method
14.10.1 LPCVD
14.10.2 PECVD
14.10.3 Thermal Oxidation
14.10.4 Others
14.11 Basis Point Share (BPS) Analysis By Method
14.12 Absolute $ Opportunity Assessment By Method
14.13 Market Attractiveness Analysis By Method
14.14 Middle East & Africa (MEA) Vertical Furnace Market Size Forecast By Application
14.14.1 Advanced Packaging
14.14.2 Semiconductor
14.14.3 Others
14.15 Basis Point Share (BPS) Analysis By Application
14.16 Absolute $ Opportunity Assessment By Application
14.17 Market Attractiveness Analysis By Application
Chapter 15 Competition Landscape
15.1 Vertical Furnace Market: Competitive Dashboard
15.2 Global Vertical Furnace Market: Market Share Analysis, 2019
15.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
15.3.1 ASM International
15.3.2 Centrotherm international AG
15.3.3 Kokusai Electric Corporation
15.3.4 Koyo Thermo Systems Co., Ltd.
15.3.5 Tempress
15.3.6 Tokyo Electron Limited
By Technology
- Wafer Size: up to 150mm
- 2-Wafer Size: 151mm – 200mm
- Wafer Size: 201mm – 300mm
By Method
- LPCVD
- PECVD
- Others
By Application
- Advanced Packaging
- Semiconductor
- Others
By Region
- North America
- U.S.
- Canada
- Latin America
- Brazil
- Mexico
- Rest of Latin America
- Europe
- Germany
- France
- Italy
- U.K.
- Spain
- Russia
- Rest of Europe
- Asia Pacific
- China
- Japan
- South Korea
- India
- Australia
- Southeast Asia
- Rest of Asia Pacific (APAC)
- Middle East & Africa (MEA)
- Saudi Arabia
- South Africa
- UAE
- Rest of Middle East & Africa (MEA)
Key Market Players Profiled in the Report
- ASM International
- Centrotherm international AG
- Kokusai Electric Corporation
- Koyo Thermo Systems Co., Ltd.
- Tempress
- Tokyo Electron Limited
Our Clients
FAQ Section
Some frequently asked quetions about this report!
Additional company profiles can be provided on request.
Yes, the report covers product specific information such as direct product portfolios and product specifications.
According to this Growth Market Reports report, the market from Vertical Furnace is likely to register a CAGR of 5.4% during forecast period 2020-2027, with an anticipated to reach around USD 6,586.3 million by the end of the 2027.
Company Market Share (in % for base year 2019) and product analysis for vertical furnace market is available in final report.
Rising demand of vertical furnace as they are used for advanced packaging, which are used for improving the device performance and high demand for semiconductor products propelling the growth of the market.
Advanced packaging, semiconductor, and others are the key application that are driving the vertical furnace market.
Factors such as competitive strength and market positioning are key areas considered while selecting top companies to be profiled.
The market is expected to witness downtrend during 2019-2020 owing to the negative impact of COVID-19 pandemic on the global vertical furnace market.
The base year considered for the global vertical furnace market report is 2019. The complete analysis period is 2017 to 2027, wherein, 2017 & 2018 are the historic years and the forecast is provided from 2020 to 2027.
Major manufactures include, ASM International, Centrotherm international AG, Koyo Thermo Systems Co., Ltd., Tempress, Tokyo Electron Limited, and Kokusai Electric Corporation.
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