Wafer–level Manufacturing Equipment Market

Wafer–level Manufacturing Equipment Market by Types (Wafer Fab Equipment, Wafer-Level Packaging, and Assembly Equipment), Applications (Foundry, Memory, and IDM), and Regions (Asia Pacific, North America, Latin America, Europe, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2021 – 2028

  • Report ID: CM-645
  • Author: Growth Market Reports
  • Rating: 4.8
  • Total Reviews: 2
  • No. Of Pages: 190
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  • Pub. Date: Upcoming
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The global wafer–level manufacturing equipment market size was valued at USD 2488.4 million in 2019 and is projected to reach USD 3487.5 million by 2028 at a CAGR of 8.8% during the forecast period. The growth of the market is attributed to industrialization in telecommunication industry.
 

Wafer–level Manufacturing Equipment Market Key Takeaways


The wafer-level manufacturing equipment is used for the production of semiconductor wafers, which includes process such as etching, lithography, stripping, inspection, and packaging. Growing number of applications of semiconductors ICs across different segments is driving the market. Wafer fabrication helps building components with required electrical structures. Wafer manufacturing process involves individual steps for resistors, transistors, conductors, and other electronic components. Rapid industrialization has increased the demand for wafer level manufacturing equipment. Packaging of the chips is called ball grid array (BGA) which is further segmented into plastic substrate (PBGA), ceramic substrate and taper (TGBA). Two types of semiconductors used are primary flat and secondary flat. Secondary flat is 180 degrees. Single side polished wafer is comparatively priced less as compared to double side polished wafer. Wafers are designed according to its industrial and product need. Silicon dioxide is used in the wafer manufacturing which gives slight brown color to it.

The Covid-19 pandemic affected the demand and supply of the market. Lockdown across the globe, supply chain disorders, and oscillating supply of raw materials forced manufacturers to shut down production leading to unfortunate decline in market growth. Launch of vaccines to combat the Covid-19 pandemic is expected to contribute to the market growth over the forecast period.

Market Trends, Drivers, Restraints, and Opportunities

  • Increasing usage in flip chip manufacturing is projected to boost the market.
  • Rapid growth in applications of semiconductor ICs in IoT is the major factor driving the market.
  • High initial capital investment cost is anticipated to hinder the market growth.
  • R&D investment and technological advancement in wafer level manufacturing is estimated to create lucrative opportunities for the market playes.

Scope of the Report

The report on the global wafer level manufacturing equipment market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.

Attributes

Details

Report Title

Wafer level manufacturing equipment Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast

Base Year

2021

Historic Data

2019–2020

Forecast Period

2021–2028

Segmentation

Types (Wafer Fab Equipment, Wafer-Level Packaging, and Assembly Equipment) and Applications (Foundry, Memory, and IDM)

Regional Scope

Asia Pacific, North America, Latin America, Europe, and Middle East & Africa

Report Coverage

Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast

Key Players Covered in the Report

Applied Materials, ASML, TEL, Lam Research, Canon, and Hitachi.

 

Market Segment Insights:

The wafer fab equipment segment to hold major market share
Based on types, the global wafer level manufacturing equipment market is segmented as wafer fab equipment, wafer-level packaging, and assembly equipment. Wafer fab is a process of production of photonic and electrical circuits which include LEDs, RF (radio frequency) amplifiers, and optical computer components. Wafer fab helps in building components with required electrical structures.

Wafer-level packaging involves attaching the top and bottom outer layers of packaging and the solder bumps to integrated circuits while still in the wafer, and then dicing the wafer.

The foundry segment is projected to expand at a high CAGR during the forecast period
On the basis of applications, the wafer level manufacturing equipment market is fragmented into foundry, memory, and IDM. The foundry segment is estimated to hold major market share during the forecast period. Wafer manufacturing equipments are used in foundry, to design the chips according to consumer needs. As each and every industry requirement is different, wafer manufacturing equipment helps to develop chips according to device.
 

Wafer–level Manufacturing Equipment Market By Types and Applications


The market in North America is projected to hold a major market share
In terms of regions, the global wafer level manufacturing equipment market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. The market in North America is subjected to hold major share during the forecast period. Several IT and mobile industries in the region use automation in the production. This enabled the North American market to boost its market hold in global market.

The market in Asia Pacific is expected to grow at a significant rate, due to rising consumer market and manufacturing. China is currently leading in the wafer level manufacturing in Asia Pacific.
 

1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Wafer–level Manufacturing Equipment Market Overview
  4.1. Introduction
     4.1.1. Market Taxonomy
     4.1.2. Market Definition
  4.2. Macro-Economic Factors
     4.2.1. Industry Outlook
  4.3. Wafer–level Manufacturing Equipment Market Dynamics
     4.3.1. Market Drivers
     4.3.2. Market Restraints
     4.3.3. Opportunity
     4.3.4. Market Trends
  4.4. Wafer–level Manufacturing Equipment Market - Supply Chain
  4.5. Global Wafer–level Manufacturing Equipment Market Forecast
     4.5.1. Wafer–level Manufacturing Equipment Market Size (US$ Mn) and Y-o-Y Growth
     4.5.2. Wafer–level Manufacturing Equipment Market Size (000’ Units) and Y-o-Y Growth
     4.5.3. Wafer–level Manufacturing Equipment Market Absolute $ Opportunity
5. Global Wafer–level Manufacturing Equipment Market Analysis and Forecast by Types
  5.1. Market Trends
  5.2. Introduction
     5.2.1. Basis Point Share (BPS) Analysis by Types
     5.2.2. Y-o-Y Growth Projections by Types
  5.3. Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Types
     5.3.1. Wafer Fab Equipment
     5.3.2. Wafer-level Packaging
     5.3.3. Assembly Equipment
  5.4. Absolute $ Opportunity Assessment by Types
  5.5. Market Attractiveness/Growth Potential Analysis by Types
6. Global Wafer–level Manufacturing Equipment Market Analysis and Forecast by Applications
  6.1. Market Trends
  6.2. Introduction
     6.2.1. Basis Point Share (BPS) Analysis by Applications
     6.2.2. Y-o-Y Growth Projections by Applications
  6.3. Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Applications
     6.3.1. Foundry
     6.3.2. Memory
     6.3.3. IDM
  6.4. Absolute $ Opportunity Assessment by Applications
  6.5. Market Attractiveness/Growth Potential Analysis by Applications
7. Global Wafer–level Manufacturing Equipment Market Analysis and Forecast by Region
  7.1. Market Trends
  7.2. Introduction
     7.2.1. Basis Point Share (BPS) Analysis by Region
     7.2.2. Y-o-Y Growth Projections by Region
  7.3. Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Region
     7.3.1. North America
     7.3.2. Latin America
     7.3.3. Europe
     7.3.4. Asia Pacific
     7.3.5. Middle East and Africa (MEA)
  7.4. Absolute $ Opportunity Assessment by Region
  7.5. Market Attractiveness/Growth Potential Analysis by Region
  7.6. Global Wafer–level Manufacturing Equipment Demand Share Forecast, 2019-2026
8. North America Wafer–level Manufacturing Equipment Market Analysis and Forecast
  8.1. Introduction
     8.1.1. Basis Point Share (BPS) Analysis by Country
     8.1.2. Y-o-Y Growth Projections by Country
  8.2. North America Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Country
     8.2.1. U.S.
     8.2.2. Canada
  8.3. Absolute $ Opportunity Assessment by Country
  8.4. North America Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Types
     8.4.1. Wafer Fab Equipment
     8.4.2. Wafer-level Packaging
     8.4.3. Assembly Equipment
  8.5. Basis Point Share (BPS) Analysis by Types
  8.6. Y-o-Y Growth Projections by Types
  8.7. North America Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Applications
     8.7.1. Foundry
     8.7.2. Memory
     8.7.3. IDM
  8.8. Basis Point Share (BPS) Analysis by Applications
  8.9. Y-o-Y Growth Projections by Applications
  8.10. Market Attractiveness/Growth Potential Analysis
     8.10.1. By Country
     8.10.2. By Product Type
     8.10.3. By Application
  8.11. North America Wafer–level Manufacturing Equipment Demand Share Forecast, 2019-2026
9. Latin America Wafer–level Manufacturing Equipment Market Analysis and Forecast
  9.1. Introduction
     9.1.1. Basis Point Share (BPS) Analysis by Country
     9.1.2. Y-o-Y Growth Projections by Country
     9.1.3. Latin America Average Pricing Analysis
  9.2. Latin America Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Country
      9.2.1. Brazil
      9.2.2. Mexico
      9.2.3. Rest of Latin America
   9.3. Absolute $ Opportunity Assessment by Country
  9.4. Latin America Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Types
     9.4.1. Wafer Fab Equipment
     9.4.2. Wafer-level Packaging
     9.4.3. Assembly Equipment
  9.5. Basis Point Share (BPS) Analysis by Types
  9.6. Y-o-Y Growth Projections by Types
  9.7. Latin America Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Applications
     9.7.1. Foundry
     9.7.2. Memory
     9.7.3. IDM
  9.8. Basis Point Share (BPS) Analysis by Applications
  9.9. Y-o-Y Growth Projections by Applications
  9.10. Market Attractiveness/Growth Potential Analysis
     9.10.1. By Country
     9.10.2. By Product Type
     9.10.3. By Application
  9.11. Latin America Wafer–level Manufacturing Equipment Demand Share Forecast, 2019-2026
10. Europe Wafer–level Manufacturing Equipment Market Analysis and Forecast
  10.1. Introduction
     10.1.1. Basis Point Share (BPS) Analysis by Country
     10.1.2. Y-o-Y Growth Projections by Country
     10.1.3. Europe Average Pricing Analysis
  10.2. Europe Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Country
     10.2.1. Germany
     10.2.2. France
     10.2.3. Italy
     10.2.4. U.K.
     10.2.5. Spain
     10.2.6. Russia
     10.2.7. Rest of Europe
  10.3. Absolute $ Opportunity Assessment by Country
  10.4. Europe Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Types
     10.4.1. Wafer Fab Equipment
     10.4.2. Wafer-level Packaging
     10.4.3. Assembly Equipment
  10.5. Basis Point Share (BPS) Analysis by Types
  10.6. Y-o-Y Growth Projections by Types
  10.7. Europe Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Applications
     10.7.1. Foundry
     10.7.2. Memory
     10.7.3. IDM
  10.8. Basis Point Share (BPS) Analysis by Applications
  10.9. Y-o-Y Growth Projections by Applications
  10.10. Market Attractiveness/Growth Potential Analysis
     10.10.1. By Country
     10.10.2. By Product Type
     10.10.3. By Application
  10.11. Europe Wafer–level Manufacturing Equipment Demand Share Forecast, 2019-2026
11. Asia Pacific Wafer–level Manufacturing Equipment Market Analysis and Forecast
  11.1. Introduction
     11.1.1. Basis Point Share (BPS) Analysis by Country
     11.1.2. Y-o-Y Growth Projections by Country
     11.1.3. Asia Pacific Average Pricing Analysis
  11.2. Asia Pacific Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Country
     11.2.1. China
     11.2.2. Japan
     11.2.3. South Korea
     11.2.4. India
     11.2.5. Australia
     11.2.6. Rest of Asia Pacific (APAC)
  11.3. Absolute $ Opportunity Assessment by Country
  11.4. Asia Pacific Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Types
     11.4.1. Wafer Fab Equipment
     11.4.2. Wafer-level Packaging
     11.4.3. Assembly Equipment
  11.5. Basis Point Share (BPS) Analysis by Types
  11.6. Y-o-Y Growth Projections by Types
  11.7. Asia Pacific Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Applications
     11.7.1. Foundry
     11.7.2. Memory
     11.7.3. IDM
  11.8. Basis Point Share (BPS) Analysis by Applications
  11.9. Y-o-Y Growth Projections by Applications
  11.10. Market Attractiveness/Growth Potential Analysis
     11.10.1. By Country
     11.10.2. By Product Type
     11.10.3. By Application
  11.11. Asia Pacific Wafer–level Manufacturing Equipment Demand Share Forecast, 2019-2026
12. Middle East & Africa Wafer–level Manufacturing Equipment Market Analysis and Forecast
  12.1. Introduction
     12.1.1. Basis Point Share (BPS) Analysis by Country
     12.1.2. Y-o-Y Growth Projections by Country
     12.1.3. Middle East & Africa Average Pricing Analysis
  12.2. Middle East & Africa Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Country
     12.2.1. Saudi Arabia
     12.2.2. South Africa
     12.2.3. UAE
     12.2.4. Rest of Middle East & Africa (MEA)
  12.3. Absolute $ Opportunity Assessment by Country
  12.4. Middle East & Africa Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Types
     12.4.1. Wafer Fab Equipment
     12.4.2. Wafer-level Packaging
     12.4.3. Assembly Equipment
  12.5. Basis Point Share (BPS) Analysis by Types
  12.6. Y-o-Y Growth Projections by Types
  12.7. Middle East & Africa Wafer–level Manufacturing Equipment Market Size and Volume Forecast by Applications
     12.7.1. Foundry
     12.7.2. Memory
     12.7.3. IDM
  12.8. Basis Point Share (BPS) Analysis by Applications
  12.9. Y-o-Y Growth Projections by Applications
  12.10. Market Attractiveness/Growth Potential Analysis
     12.10.1. By Country
     12.10.2. By Product Type
     12.10.3. By Application
  12.11. Middle East & Africa Wafer–level Manufacturing Equipment Demand Share Forecast, 2019-2026
13. Competition Landscape
  13.1. Global Wafer–level Manufacturing Equipment Market: Market Share Analysis
  13.2. Wafer–level Manufacturing Equipment Distributors and Customers
  13.3. Wafer–level Manufacturing Equipment Market: Competitive Dashboard
  13.4. Company Profiles (Details: Overview, Financials, Developments, Strategy)
     13.4.1. Applied Materials
     13.4.2. ASML
     13.4.3. TEL
     13.4.4. Lam Research
     13.4.5. Canon
     13.4.6. Hitachi

Segments Covered in the Report
The global wafer manufacturing equipment market is segmented on the basis of

Types

  • Wafer Fab Equipment
  • Wafer-level Packaging
  • Assembly Equipment

Applications

  • Foundry
  • Memory
  • IDM

Regions

  • Asia Pacific
  • North America
  • Latin America
  • Europe
  • Middle East & Africa

Key Players

  • Applied Materials
  • ASML
  • TEL
  • Lam Research
  • Canon
  • Hitachi

Major players in the global wafer level manufacturing equipment market include Applied Materials, ASML, TEL, Lam Research, Canon, and Hitachi.

Companies are engaging in mergers, acquisitions and partnerships to extend their market share. Moreover they are focusing on expanding their product portfolio to leverage their market position. Global sales of wafer processing equipment rose 19% in 2020, while other front-end segment sales grew 4%. Assembly and packaging showed strong growth across all regions, resulting in a 34% increase, while total test equipment sales increased 20% in 2020.
 

Wafer–level Manufacturing Equipment Market Key Players

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