The global wafer–level manufacturing equipment market size was valued at USD 3204.84 million in 2022 and is projected to reach USD 6846.47 million by 2031 at a CAGR of 8.8% during the forecast period 2023-2031. The growth of the market is attributed to industrialization in telecommunication industry.
The wafer-level manufacturing equipment is used for the production of semiconductor wafers, which includes process such as etching, lithography, stripping, inspection, and packaging. Growing number of applications of semiconductors ICs across different segments is driving the market. Wafer fabrication helps building components with required electrical structures.
Wafer manufacturing process involves individual steps for resistors, transistors, conductors, and other electronic components. Rapid industrialization has increased the demand for wafer level manufacturing equipment. Packaging of the chips is called ball grid array (BGA) which is further segmented into plastic substrate (PBGA), ceramic substrate and taper (TGBA).
Two types of semiconductors used are primary flat and secondary flat. Secondary flat is 180 degrees. Single side polished wafer is comparatively priced less as compared to double side polished wafer. Wafers are designed according to its industrial and product need. Silicon dioxide is used in the wafer manufacturing which gives slight brown color to it.
The Covid-19 pandemic affected the demand and supply of the market. Lockdown across the globe, supply chain disorders, and oscillating supply of raw materials forced manufacturers to shut down production leading to unfortunate decline in market growth. Launch of vaccines to combat the Covid-19 pandemic is expected to contribute to the market growth over the forecast period.
Market Trends, Drivers, Restraints, and Opportunities
Increasing usage in flip chip manufacturing is projected to boost the market.
Rapid growth in applications of semiconductor ICs in IoT is the major factor driving the market.
High initial capital investment cost is anticipated to hinder the market growth.
R&D investment and technological advancement in wafer level manufacturing is estimated to create lucrative opportunities for the market playes.
Scope of Wafer level Manufacturing Equipment Market Report
The report on the global wafer level manufacturing equipment market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.
Wafer level manufacturing equipment Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast
Types (Wafer Fab Equipment, Wafer-Level Packaging, and Assembly Equipment) and Applications (Foundry, Memory, and IDM)
Asia Pacific, North America, Latin America, Europe, and Middle East & Africa
Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast
Key Players Covered in the Report
Applied Materials, ASML, TEL, Lam Research, Canon, and Hitachi.
Wafer–level Manufacturing Equipment Market Segment Insights
The wafer fab equipment segment to hold major market share
Based on types, the global wafer level manufacturing equipment market is segmented as wafer fab equipment, wafer-level packaging, and assembly equipment. Wafer fab is a process of production of photonic and electrical circuits which include LEDs, RF (radio frequency) amplifiers, and optical computer components. Wafer fab helps in building components with required electrical structures.
Wafer-level packaging involves attaching the top and bottom outer layers of packaging and the solder bumps to integrated circuits while still in the wafer, and then dicing the wafer.
The foundry segment is projected to expand at a high CAGR during the forecast period
On the basis of applications, the wafer level manufacturing equipment market is fragmented into foundry, memory, and IDM. The foundry segment is estimated to hold major market share during the forecast period. Wafer manufacturing equipments are used in foundry, to design the chips according to consumer needs. As each and every industry requirement is different, wafer manufacturing equipment helps to develop chips according to device.
The market in North America is projected to hold a major market share
In terms of regions, the global wafer level manufacturing equipment market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. The market in North America is subjected to hold major share during the forecast period. Several IT and mobile industries in the region use automation in the production. This enabled the North American market to boost its market hold in global market.
The market in Asia Pacific is expected to grow at a significant rate, due to rising consumer market and manufacturing. China is currently leading in the wafer level manufacturing in Asia Pacific.
The global wafer manufacturing equipment market is segmented on the basis of
- Wafer Fab Equipment
- Wafer-level Packaging
- Assembly Equipment
- Asia Pacific
- North America
- Latin America
- Middle East & Africa
- Applied Materials
- Lam Research
Major players in the global wafer level manufacturing equipment market include Applied Materials, ASML, TEL, Lam Research, Canon, and Hitachi.
Companies are engaging in mergers, acquisitions and partnerships to extend their market share. Moreover they are focusing on expanding their product portfolio to leverage their market position. Global sales of wafer processing equipment rose 19% in 2020, while other front-end segment sales grew 4%. Assembly and packaging showed strong growth across all regions, resulting in a 34% increase, while total test equipment sales increased 20% in 2020.