Semiconductor Packaging Market by Packaging Platforms (Flip Chip, Embedded DIE, Fan-in Wafer Level Packaging, Fan-out Wafer Level Packaging), End-user Industries (Consumer Electronics, Aerospace and Defense, Medical Devices, Communications and Telecom, Automotive Industry, and Energy and Lighting), and Regions (Asia Pacific, North America, Latin America, Europe, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2021 – 2028

The global semiconductor packaging market size is projected to expand at a considerable CAGR during the forecast period, 2021–2028. The growth of the market is attributed to the increasing demand for consumer electronics in emerging economies.

Semiconductor packaging is a protective case that prevents physical damage to silicon wafers, logic units, and memory during the final stage of semiconductor manufacturing process. It makes chip to connect to circuit easily. Semiconductor devices are thinned, attached, bonded, and encapsulated with materials, enabling the development of innovative packaging technologies.

Semiconductor packaging materials are used to safeguard devices from deterioration and external influence. The outbreak of COVID-19 led to halt of the production for few months in 2020, affecting supply and revenue chain in the market. However, the relaxation on restriction eased the production and trade activities, and is expected to reach pre-COVID level by end of 2021.

Market Trends, Drivers, Restraints, and Opportunities

• Rising demand for various electronic applications is expected to boost the market growth.
• Rapid growth of the electric vehicle (EV) industry can positively influence the growth of the market.
• Chip shortage is anticipated to impede the market growth.
• Increasing cost of raw materials can hinder the growth of the market.
• Growing investments in electronics applications along with low-cost manufacturing, low workforce cost, and easy convenience of the raw materials can create lucrative opportunities for the market players.

Scope of the Report

The report on the global semiconductor packaging market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.

Semiconductor Packaging Market Segment Insights

Flip chip segment is expected to grow at a rapid pace

Based on packaging platforms, the market is divided into flip chip, embedded die, fan-in wafer level packaging, fan-out wafer level packaging. The flip chip segment is expected to grow at a rapid pace during the forecast period owing to superior electrical and thermal performance. However, the embedded DIE segment is anticipated to hold a key share of the market in the coming years owing to lower electrical & thermal resistivity in package, which improves power performance.

Automotive segment is projected to expand at a considerable CAGR

On the basis of end-user industries, the market is segregated into consumer electronics, aerospace and defense, medical devices, communications and telecom, automotive industry, and energy and lighting. The automotive segment is projected to expand at a considerable CAGR during the forecast period on account of increasing demand for electric cars globally. On the other hand, the medical devices segment is anticipated to account for a major market share during the forecast period owing to increasing demand for medical instruments amidst the pandemic.

North America is anticipated to constitute a key market share

In terms of regions, the global semiconductor packaging market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. The market in North America is expected to constitute a key share of the market during the projected timeline owing to growing adoption of medical devices in the healthcare industry. However, Asia Pacific is anticipated to expand at a  healthy rate during the forecast period owing to relaxation on international trade activities.

Segments

Segments Covered in the Report

The global semiconductor packaging market has been segmented on the basis of

Packaging Platforms

• Flip Chip
• Embedded DIE
• Fan-in Wafer Level Packaging
• Fan-out Wafer Level Packaging

End-user Industries

• Consumer Electronics
• Aerospace and Defense
• Medical Devices
• Communications and Telecom
• Automotive Industry
• Energy and Lighting

Regions

• Asia Pacific
• North America
• Latin America
• Europe
• Middle East & Africa

Key Players

• ASE Group
• Amkor Technology
• JCET/Stats Chippac Ltd
• Siliconware Precision Industries Co. Ltd (SPIL)
• Powetech Technology, Inc.

Competitive Landscape

Key players competing in the global semiconductor packaging market are ASE Group; Amkor Technology; JCET/Stats Chippac Ltd; Siliconware Precision Industries Co. Ltd (SPIL); and Powetech Technology, Inc.

In August 2021, Amkor Technology, a prominent provider of outsourced semiconductor assembly and test (OSAT) services, advanced the evolution of 5G RF module design, characterization and packaging technology, and empowered RF front-end cellular innovations with advanced SIP.

In July 2021, JCET/Stats Chippac Ltd., a provider of packaging and test manufacturing services, completed the acquisition of ADI, a Singapore-based test facility, to enhance the market competitiveness.