Segments - Semiconductor Metrology and Inspection Market by Type (Thin Film Metrology, Lead Frame Inspection, Wafer Inspection System, Bump Inspection, Mask Inspection System, and Others), Technology (E-beam and Optical), Organization Size (Small & Medium Enterprises and Large Enterprises), and Region (Asia Pacific, North America, Latin America, Europe, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2023 – 2031
The global semiconductor metrology and inspection market size was USD 7.5 Billion in 2022 and is likely to reach USD 13.4 Billion by 2031, expanding at a CAGR of 6.3% during 2023–2031. The market growth is attributed to the high demand for smart devices.
High demand for electronic devices is expected to boost the semiconductor metrology and inspection market during the forecast period. Several consumers use advanced technologies and increase in the number of reliable internet connections which increases the demand for smart devices in the market. These electronic devices use semiconductor metrology and inspection to ensure that every stage of the semiconductor production process is accomplished to the highest possible level.
According to a survey report, in the US around 63.43 million households are actively using smart home devices in 2023 and this is 10.2% more than in 2022.
The market report finds that the COVID-19 pandemic hampered the semiconductor metrology and inspection market, due to the strict lockdown and the temporary factory shutdowns. During the pandemic, there was a huge backlog of orders and the loss of many SMEs which hampered the market. Several manufacturers suffered critical losses due to factory closures, low production volumes, and the postponement of their production cycles affected the market.
Artificial Intelligence (AI) technologies are expected to boost the semiconductor metrology and inspection market during the forecast period. AI systems are adopted in the semiconductor industry, particularly in the areas of inspection, metrology, and testing. These systems are used to capture and classify defects in optical and e-beam images with lessened errors, without slowing down the production.
AI systems are used to match designs that are similar for testing. These systems are used to capture critical defects for wafers, reticles, PCBs, and packages. To achieve better accuracy, semiconductor industries use live tool-sensor readings, tool-sensor data, and metrology readings from previous process steps, which allows machine learning (ML) models to acquire nonlinear relations between process time and outcomes.
Increasing demand for semiconductors, as several manufacturers are focusing on expanding their manufacturing facilities is expected to drive the semiconductor metrology and inspection market. Mask & wafer inspection and other metrology & inspection systems are used in the semiconductor inspection in the production lines. This system detects the defects and ensures the quality of the manufactured semiconductor devices, which increases the demand for semiconductors in the market. Several manufacturers are introducing new innovative products, which help the market in the coming years.
In November 2020, Hitachi High-Tech Corporation launched the high-speed defect review SEM*1 CR7300. This new model of review of SEM contributes to the productivity in the development of cutting-edge semiconductor devices. Greater electron optics permits to acquisition best high-resolution images to date, while the innovative imaging and stage systems enable high-speed image acquisition in half of the time as compared with traditional methods. This reduces the entire inspection time.
Fluctuations in raw materials prices and maintenance costs are expected to hamper the semiconductor metrology and inspection market. Several manufacturers need to maintain various equipment to process the flow of wafers, packaged parts, dies, and boards that run the factory. The complicated process of maintenance is expected to impact the semiconductor metrology and inspection market in the coming years.
Rising new product innovation is expected to create lucrative opportunities for the market players. Several companies are focusing on developing new innovative technologies to expand the inspection process and ensure the quality of semiconductor devices.
In July 2022, Onto Innovation Inc., introduced an innovative acoustic metrology product named New Echo System. The in-line characterization of opaque films has increased because of the new echo system, by imposing the principle of picosecond ultrasonics to provide material characterization and vital thickness metrology for important technology transition in the high-stack NAND and cutting-edge DRAM memory markets, which is expected to be around USD 110 million.
The market report includes an assessment of the market trends, market segments, and regional markets. Overview and dynamics have also been included in the report.
Attributes |
Details |
Report Title |
Semiconductor Metrology and Inspection Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast |
Base Year |
2022 |
Historic Data |
2016–2021 |
Forecast Period |
2023–2031 |
Segmentation |
Type (Thin Film Metrology, Lead Frame Inspection, Wafer Inspection System, Bump Inspection, Mask Inspection System, and Others), Technology (E-beam and Optical), and Organization Size (Small & Medium Enterprises and Large Enterprises) |
Regional Scope |
Asia Pacific, North America, Latin America, Europe, and Middle East & Africa |
Report Coverage |
Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, Market Trends, and Revenue Forecast |
Key Players Covered in the Report |
Thermo Fisher Scientific Inc.; Onto Innovation; NOVA; Nearfield Instruments B.V.; Lasertec Corporation; KLA Corporation; JEOL Ltd.; Hitachi, Ltd.; Canon U.S.A., Inc.; ASML; and Applied Materials, Inc. |
Based on type, the semiconductor metrology and inspection market is divided into thin film metrology, lead frame inspection, wafer inspection system, bump inspection, mask inspection system, and others. The wafer inspection system segment is expected to expand at a significant pace during the projection period, as it provides the data for chip manufacturers. This system detects the pattern and physical defects on wafers and obtains the position coordinates of the defects. It allows engineers to quickly detect, monitor, and resolve excursions to deliver greater control of the quality of improved device performance.
In December 2022, Hitachi High-Tech Corporation launched LS9600 for identifying particles and defects on non-patterned wafer surfaces. This new system includes a new high-output and short-wavelength laser that expands the sensitivity levels that are essential for the mass production of leading-edge semiconductor devices by 2.6 times compared to last-generation systems.
The thin film metrology segment is anticipated to hold a key share of the market in the coming years, as it uses less semiconductor material, makes them lighter as crystalline silicon cells, and is cost-effective to install. These thin film metrology instruments are used in a wide range of deposition processes and provide thin film process control for crucial parameters such as film thickness, temperature, surface roughness, deposition rate, stress, reflectivity, bow, curvature, and other material properties.
In terms of technology, the global market is segregated into e-beam and optical. The optical segment is projected to register a considerable CAGR during the forecast period, as it is quicker and is being stretched to the innovative nodes limit. Optical inspection of semiconductors refers to inspection where measurements are taken using light and its reflection. There are two main categories of optical inspection such as darkfield and brightfield. Darkfield inspection instruments measure a reduced angle of reflection and brightfield inspection measures light coming from a higher angle.
On the basis of organization size, the semiconductor metrology and inspection market is segmented into small & medium enterprises (SMEs) and large enterprises. The large enterprises segment is expected to register a robust growth rate during the forecast period. Several companies are focusing on developing new technologies that help the market, thus, in turn, is expected to boost the segment in the market.
In November 2021, Samsung Electronics Co., Ltd., announced a new semiconductor manufacturing facility in Texas. This is a projected USD 17 billion investment in the US that helps to boost the production of innovative logic semiconductor solutions that control next-generation technologies and innovations.
In terms of region, the global semiconductor metrology and inspection market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. Aisa Pacific is expected to dominate the market during the projection period, due to the increasing semiconductor industry in emerging countries such as Japan, China, South Korea, and India. The regional market growth is further attributed to the increasing concentration of integrated circuit (IC) makers. ICs are used in a variety of industries such as industrial, consumer electronics, data centers, telecommunications, and automotive.
The global semiconductor metrology and inspection market has been segmented on the basis of
Key players competing in the global semiconductor metrology and inspection market are Thermo Fisher Scientific Inc.; Onto Innovation; NOVA; Nearfield Instruments B.V.; Lasertec Corporation; KLA Corporation; JEOL Ltd.; Hitachi, Ltd.; Canon U.S.A., Inc.; ASML; and Applied Materials, Inc.
These key players adopt various strategies including mergers, acquisitions, collaboration, partnerships, product launches, and production expansion to expand their consumer base globally.