IC Design Service Market Size, Share & Trends Growth [2031]

IC Design Service Market Size, Share & Trends Growth [2031]

Segments - IC Design Service Market by Type (Analog IC, Digital IC, and Mixed IC), Service Type (Circuit Design, Layout Design, Package Design, and Others), Enterprise Size (Small & Medium Enterprise, Large Enterprise), Application (Micro components (MCU/MPU), FPGAs, Memories, Analog, Optical sensor, Non-optical sensors, Digital ASICs, and Others), End-use Industry (Communication, Consumer Electronics, Automotive, Computing, and Industrial), Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa (MEA)) - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2023-2031

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Author : Raksha Sharma
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Upcoming | Report ID :ICT-SE-6370 | 4.8 Rating | 68 Reviews | 433 Pages | Format : PDF Excel PPT

Report Description


Market Outlook:

The Global IC Design Service Market was valued at USD 18,495.2 Million in 2022 and is projected to reach USD 56,071.9 Million by 2031, expanding at a CAGR of 13.3% during the forecast period.

IC design service is the process of designing an integrated circuit (ICs). The primary objective of IC design is to perform a specific operation by assembling interconnected circuit elements. IC design services offer a comprehensive suite of solutions, from concept development and architecture design to layout and verification. These solutions cater to the diverse needs of semiconductor companies and other industries requiring custom IC solutions.

IC Design Service Market Outlook

IC design services are offered by specialized companies or design teams, catering to the requirements of clients seeking custom chip designs tailored to their specific applications. Outsourcing IC design allows companies to concentrate on their main strengths, lower their expenses for development & production, and speed up the delivery of their products to the market.

COVID-19 Impact on the Global IC Design Service Market

The research report finds that the COVID-19 pandemic had a significant impact on the operations of IC design resulted in less demand for direct labor when compared to foundries and OSAT firms. Thus, the IC design industry was not as severely affected by the pandemic as the semiconductor industry. Furthermore, EDA companies and foundries expanded their cloud-based design and verification environments. Thus, IC designers were able to overcome the operational and output shortcomings associated with having their personnel work remotely through these cloud-based platforms.

Artificial Intelligence (AI) Impact on the Global IC Design Service Market

The impact of Artificial Intelligence (AI) on the global IC design service market is an emerging area of research and development. Artificial intelligence (AI) is transforming the field of integrated circuit (IC) design, allowing semiconductor manufacturers to produce better circuits faster, more efficiently, and at a lower cost.

Advanced AI tools are significantly accelerating semiconductor chip design. These techniques can arrange 100 billion transistors on a single square inch, which was previously difficult for human engineers. Chips with process nodes less than 10 nm particularly used in smartphones, laptops, and others are the chip market's fastest-growing and most profitable segment. In recent years, the top EDA vendors have started selling advanced AI-powered tools, while chipmakers and tech companies have built their own AI design tools.

Macro-economic Factors

Economic Growth:

Global economic growth has a significant influence on the IC design services market. The global economic growth has resulted in substantial investments in the IC industry, leading to the market share concentration among dominant companies.

  • For instance, in 2022, the Taiwan Semiconductor Manufacturing Company (TSMC) spent USD 30 billion toward production expansion. This move reduced its gross margin from 51.5% to 49.5%. TSMC also announced plans to construct a second chip manufacturing facility in Arizona, US, raising the initial investment to USD 40 billion.

Regional governments are also providing support to develop their national IC industry ecosystem. For instance, China has been aggressively constructing new fab capacities, accelerated by the introduction of the China Integrated Circuit Investment Fund.

Government Initiatives:

  • US: The US government enacted the Creating Helpful Incentives to produce Semiconductors (CHIPS) for America Act in 2020. This act aims to restore semiconductor manufacturing in the US and secure the supply chain.

  • European Union (EU): The EU initiated the Important Projects of Common European Interest (IPCEI) on Microelectronics. This project focuses on research and innovation in microelectronics, a key enabling technology for all critical digital technologies.

  • China: In August 2020, the State Council of China issued the notice on several policies to promote the high-quality development of the integrated circuit industry and software industry. This notice provides a broad framework for the development of the semiconductor industry.

  • India: In May 2020, the government of India outlined its Aatmanirbhar Bharat vision, with plans to become a self-sustaining semiconductor production unit. Some schemes that are introduced include the Production Linked Incentive (PLI), Scheme for Promotion of Manufacturing Components & Semiconductors (SPECS), and the Modified Electronics Manufacturing Clusters (EMC 2.0) Scheme.

Technological Advancement

Technological advancements have a profound impact on the IC design services market. The demand for increasingly complex and efficient ICs increases, as technology evolves. This is particularly evident in sectors such as consumer electronics, automotive, and telecommunications, where advancements such as 5G, 6G, AI, and IoT are increasing the need for high-performance ICs.

Designing these advanced ICs is a complex task that requires specialized skills and knowledge. Therefore, many companies are outsourcing their IC design needs to specialized service providers, thereby boosting the growth of the IC design services market.

  • For instance, in 2023, Sivers Semiconductors has secured a USD 1.3 million from HORIZON Europe to spearhead a 6G chip design initiative. The grant is expected to fund 90% of the involvement of Sivers in the project, which aims to develop millimetre Wave (mm Wave) building blocks for next-generation 6G technology over a span of 3.5 years. For example, plans were announced for the construction of first semiconductor fabrication plant in the country by the Israel-based International Semiconductor Consortium in February 2023.

Investments in R&D

Governments across the globe play a crucial role in promoting research and development (R&D), including in the field of Integrated Circuit (IC) design. They provide support through various means such as direct funding, grants, and tax incentives in various countries as follow:

  • China: The government of China launched the National Integrated Circuit Industry Development Program in 2014, allocating funds to domestic chipmakers, research institutions, and talent development. The program fuelled rapid growth in the China IC industry, making the country the largest chip importer across the globe.

  • US: The CHIPS Act of 2022 allocated USD 52 billion to boost domestic semiconductor manufacturing and R&D. the act aims to counter technological advancement in China and revitalize the US chip industry.

Market Dynamics

Market Drivers - Rising Adoption of Sophisticated and Miniaturized IC Designs

The increasing demand for more sophisticated and miniaturized IC designs is boosting the IC design service market by creating more demand for specialized and customized solutions for various applications and industries. As technology advances, the demand for more sophisticated and feature-rich electronic devices rises. Miniaturization induces the demand for complex and powerful system-on-chip (SoC) designs, which integrate multiple functions and components on a single chip. This increases the demand for IC design services that can handle the challenges of SoC design, such as verification, optimization, and testing.

  • For instance, the latest transistor technology in terms of nanometer (nm) scale is the 2 nm chip technology, which was unveiled by IBM in May 2021. This technology uses nanosheet FETs, which are a type of gate-all-around (GAA) FETs, to achieve 45% higher performance or 75% lower energy use than the most advanced 7 nm node chips. IBM claims that this technology can fit up to 50 billion transistors on a chip, the size of a fingernail.

Market Drivers - AI and ML Integration for Error Detection in IC Designs

The continuous evolving IC technology has made it possible to produce chips with several millions of transistors. However, it has increased the complexity in IC design, leading to errors. AI and ML are increasingly being used for detecting these errors by applying various methods and techniques to analyze the data and features of the ICs, such as their images, waveforms, electrical behavior, and functional performance. AI and ML algorithms are used to identify and correct anomalies, defects, and inconsistencies that indicate the presence of errors in the IC designs, which may compromise the quality and reliability of the electronic systems that use them.

  • For instance, Machine learning-based error detection and design optimization method is increasingly being used for error detection.

Market Restraints - High Investment Requirements

The IC design service market requires high capital expenditure for acquiring skilled engineering resources, software licenses, and design tools. The market is highly dependent on the availability and cost of skilled engineers and technicians, which can be challenging in some regions. A team usually includes several people, which includes a Product Definition Engineer, who writes the specification; Analog Design Engineers, who take the specification and design the analog portion of the IC and small digital sections; Digital Design Engineer who writes the register transfer logic (RTL) code for digital sections that are more than 100-1000 gates; Place and Route (P&R) Engineer who takes the RTL code and generates a layout for just the digital logic gates; Top Level System Simulation Engineer who simulates the whole mixed mode IC, including building models for the analog pieces; Layout Designer who handcrafts the IC schematic into a physical database, drops in the digital P&R, and routes up the pads and peripheral electronics; Test Engineer who designs the test hardware and writes the production test program; and a Program Manager, to oversee the overall IC development team.

Market Opportunity - Proliferation of 6G Technology

The proliferation of 6G technology is projected to create numerous opportunities for the IC design service market by increasing the demand for advanced and customized ICs for various applications and industries. 6G technology is expected to offer data speeds of up to 100 Gbps, ultra-low latency, massive connectivity, and enhanced intelligence, enabling new use cases such as holographic communication, brain-computer interface, and quantum internet. To support these use cases, the IC design service market will need to provide innovative solutions for high-performance, low-power, and secure digital circuits, as well as integrate artificial intelligence and machine learning into the design process.

  • For instance, in 2022, Department of Telecommunications (DoT) of India launched Bharat 6G Alliance (B6GA) to drive Innovation and Collaboration in Next-Generation Wireless Technology, a collaborative platform consisting of public and private companies, academia, research institutions, and Standards development organizations.

Scope of the Report

The report on the Global IC Design Service Market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.

Attributes

Details

Report Title

IC Design Service Market – Global Industry Analysis, Size, Share, Growth, Trends, and Forecast

Base Year

2022

Historic Data

2016-2021

Forecast Period

2023–2031

Segmentation

By Type (Analog IC, Digital IC, and Mixed IC), By Service Type (Circuit Design, Layout Design, Package Design, and Others), By Enterprise Size (Small & Medium Enterprise, Large Enterprise), By Application (Micro components (MCU/MPU), FPGAs, Memories, Analog, Optical sensor, Non-optical sensors, Digital ASICs, and Others), By End-use Industry (Communication, Consumer Electronics, Automotive, Computing, and Industrial)

Regional Scope

Asia Pacific, North America, Latin America, Europe, and Middle East & Africa

Report Coverage

Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast

Key Players Covered

Synopsys, Inc., Cadence Design Systems, Inc., SoftBank Group. (Arm Holdings plc.), Siemens, Samsung, Taiwan Semiconductor Manufacturing Company Limited, Qualcomm Incorporated., MediaTek Inc., Texas Instruments Incorporated., Microchip Technology Inc., Cyient, Toshiba Information Systems, ULKASEMI, Chipus Microelectronics, ELSYS Design, ASIC North, EnSilica, TEZZARON., Akronic, P.C., Sondrel, and Device Engineering Inc.

 

Segmental Outlook

The Global IC Design Service Market is segmented on the basis of type, service type, enterprise size, application, and end-use industry.

On the basis of type, the Global IC Design Service Market is segmented into analog IC, digital IC, and mixed IC. The digital IC segment held significant share of the market in 2022 and is projected to expand at a significant CAGR during the forecast period. The growth of digital ICs is driven by the rising complexity and miniaturization of IC designs, which require increasingly sophisticated and efficient digital circuitry for high performance and functionality.

IC Design Service Market Type

Based on Service Type, the IC design service market is segmented into Circuit Design, Layout Design, Package Design and Others. The Circuit Design Segment is expected to hold a significant market share during the forecast period, owing to rising demand for high-performance and low-power digital circuit design, as well as increased use of automation tools and software. These technologies enable designers to automate repetitive processes like circuit development, simulation, and verification, freeing up time for more difficult and imaginative design work. Also, Emerging technologies such as nanotechnology, quantum computing, and neuromorphic computing are expected to revolutionize the Circuit design process.

IC Design Service Market Type

On the basis of enterprise size, the IC design service market is segmented into small & medium enterprise and large enterprise. The large enterprise segment held significant market share in 2022 and is projected to expand at a significant CAGR during the forecast period, owing to the rising demand of IC design services in large enterprises. IC design services help the organization to stay forefront in technological advancements and maintain a competitive edge in the market.

IC Design Service Market Enterprose Size

Based on application, the IC design service market is segmented into micro components (MCU/MPU), FPGAs, memories, analog, optical sensor, non-optical sensors, digital ASICs, and others. The memories segment held significant share of the market in 2022 during the forecast period. IC design services provide a flexible, efficient, and cost-effective approach to memory application development, enabling the creation of complex and reliable memory-based products for various applications.

Based on End-Use industry, the IC design service market is segmented into Communication, Consumer Electronics, Automotive, Computing, and Industrial. The computing Segment held significant share of the market in 2022 and is projected to expand at a significant CAGR during the forecast period, owing to advancements in big data analytics, artificial intelligence, and machine learning, there has been a significant increase in demand for high-performance computing. ICs used in computers, servers, and data centers are critical components of these systems, driving demand for IC design services in this segment. Also, the adoption of cloud computing is driving the demand for ICs in data centers, as more data centers are being built to support cloud computing services.

IC Design Service Market End Use Industry

Regional Outlook

On the basis of region, the Global IC Design Service Market is divided into North America, Europe, Asia Pacific, Latin America, and Middle East & Africa. North America held significant market share in 2022. The growth is largely attributed to the growing consumer electronics industry in the region. The market is characterized by the presence of major industry players and advanced technology resources. The adoption of IoT devices and the prevalence of data centers have boosted demand for IC design services in the region. The US dominates the North American IC design service market. The government support and investment in the IC industry, such as the CHIPS for America Act, aim to boost the domestic production and research of semiconductors.

IC Design Service Market Regions

Key Companies Strategies & Developments

  • On November 2023, Synopsys, Inc. stated that it has expanded its ARC Processor IP portfolio to include new RISC-V ARC-V Processor IP, allowing buyers to select from a variety of flexible, extensible processor solutions that provide maximum power-performance efficiency for their target applications.

  • On October 2023, Cadence Design Systems, Inc. announced the acquisition of Intrinsix Corporation from CEVA, Inc. Cadence Design Systems, Inc. received a highly qualified engineering team with expertise in advanced nodes, radio frequency, mixed-signal, and security algorithms, allowing it to scale its system and IC design services team and increase its presence in important high-growth verticals, including aerospace and defense.

  • On September 2023, Qualcomm Technologies, Inc. announced that it has entered into an agreement with Apple Inc. to supply Snapdragon 5G ModemRF Systems for smartphone launches in 2024, 2025, and 2026. This agreement reinforces the track record of the company of sustained leadership across 5G technologies and products.

  • On December 2022, Taiwan Semiconductor Manufacturing Company Limited announced starting of the construction for a second fab, which is expected to begin production of 3nm process technology in 2026. This is in addition to the first fab in Arizona, which is set to begin production of N4 process technology in the first half of 2025. Additionally, the company is moving forward with its proposal to build a fab in Kumamoto, Japan.

Key Benefits for Industry Participants & Stakeholders

  • In-depth Analysis of the Global IC Design Service Market

  • Historical, Current, and Projected Market Size in terms of Value and Volume

  • Potential & Niche Segments and Regions Exhibiting Promising Growth Covered

  • Industry Drivers, Restraints, and Opportunities Covered in the Study

  • Recent Industry Trends and Developments

  • Competitive Landscape & Strategies of Key Players

  • Neutral Perspective on Global IC Design Service Market

Segments

Type

  • Analog IC
  • Digital IC
  • Mixed IC

Service Type

  • Circuit Design
  • Layout Design
  • Package Design
  • Others

Enterprise Size

  • Small & Medium Enterprise
  • Large Enterprise

Application

  • Micro components (MCU/MPU)
  • FPGAs
  • Memories
  • Analog
  • Optical sensor
  • Non-optical sensors
  • Digital ASICs
  • Others

End-use Industry

  • Communication
    • Wired communication
    • Smart Phones
    • Other Wireless communication
  • Consumer Electronics
    • TV
    • Wearables
    • Others
  • Automotive
    • ADAS
    • Infotainment and Cluster
    • Body
    • Chassis
    • Powertrain
    • Passive safety
    • Others
  • Computing
    • Servers
    • PCs
    • Others
  • Industrial
    • Security
    • Automation
    • Medical/Healthcare
    • Energy/Power
    • Solid-State Lightning
    • Transportation
    • Others

Region

  • North America
  • Europe
  • Asia Pacific
  • Latin America
  • Middle East & Africa (MEA)

Key Market Players Profiled in the Report

Competitive Landscape

  • Key players competing in the market include Synopsys, Inc., Cadence Design Systems, Inc., SoftBank Group. (Arm Holdings plc.), Siemens, Samsung, Taiwan Semiconductor Manufacturing Company Limited, Qualcomm Incorporated., MediaTek Inc., Texas Instruments Incorporated., Microchip Technology Inc., Cyient, Toshiba Information Systems, ULKASEMI, Chipus Microelectronics, ELSYS Design, ASIC North, EnSilica, TEZZARON., Akronic, P.C., Sondrel, and Device Engineering Inc.

  • These companies are considered key providers of IC Design Service based on their revenue, product offerings, regional presence, and value chain management system.

  • These players are adopting key strategies, such as acquisition, collaborations, and geographical expansion, to boost their market share.

    IC Design Service Market Key Players

Frequently Asked Questions

The base year considered for the Global IC Design Service Market report is 2022. The complete analysis period is 2016 to 2031, wherein, 2016 to 2021 are the historic years, and the forecast is provided from 2023 to 2031.

In addition to market size (in USD Million), company market share (in % for base year 2022) and value has been provided in the report.

The fabless operations of IC design resulted in less demand for direct labor when compared to foundries and OSAT firms. Thus, the IC design industry was not severely affected by the pandemic in semiconductor industry.

Factors such as economic growth, government initiatives, technological advancement, Investments in R&D, and geopolitical landscape influence the market.

According to this Growth Market Reports report, the Global IC Design Service Market is anticipated to register a CAGR of 13.3% during the forecast period 2023-2031, with an anticipated valuation of USD 56,071.9 Million by the end of 2031.

Rising Adoption of Sophisticated and Miniaturized IC Designs, and AI and ML Integration for Error Detection in IC Designs are the major factors driving the market during the forecast period.

Factors such as competitive strength and market positioning are key areas considered while selecting top companies to be profiled.

Additional company profiles can be provided on request. For any discussion related to above findings, click Speak to Analyst

Table Of Content

Chapter 1 Executive Summary
Chapter 2 Assumptions and Acronyms Used
Chapter 3 Research Methodology
Chapter 4 IC Design Service Market Overview
   4.1 Introduction
      4.1.1 Market Taxonomy
      4.1.2 Market Definition
      4.1.3 Macro-Economic Factors Impacting the Market Growth
   4.2 IC Design Service Market Dynamics
      4.2.1 Market Drivers
      4.2.2 Market Restraints
      4.2.3 Market Opportunity
   4.3 IC Design Service Market - Value Chain Analysis
   4.4 Key Forces Shaping the IC Design Service Market
      4.4.1 Bargaining Power of Suppliers
      4.4.2 Bargaining Power of Buyers
      4.4.3 Threat of Substitution
      4.4.4 Threat of New Entrants
      4.4.5 Competitive Rivalry
   4.5 Global IC Design Service Market Size & Forecast, 2016-2031
      4.5.1 IC Design Service Market Size and Y-o-Y Growth
      4.5.2 IC Design Service Market Absolute $ Opportunity
   4.6 Current & Future Trends
   4.7 Investment Scenario
   4.8 Overview on Adoption of New Materials in IC Design
Chapter 5 Global IC Design Service Market Analysis and Forecast By Type
   5.1 Introduction
      5.1.1 Key Market Trends & Growth Opportunities By Type
      5.1.2 Basis Point Share (BPS) Analysis By Type
      5.1.3 Absolute $ Opportunity Assessment By Type
   5.2 IC Design Service Market Size Forecast By Type
      5.2.1 Analog IC
      5.2.2 Digital IC
      5.2.3 Mixed IC
   5.3 Market Attractiveness Analysis By Type
Chapter 6 Global IC Design Service Market Analysis and Forecast By Service Type
   6.1 Introduction
      6.1.1 Key Market Trends & Growth Opportunities By Service Type
      6.1.2 Basis Point Share (BPS) Analysis By Service Type
      6.1.3 Absolute $ Opportunity Assessment By Service Type
   6.2 IC Design Service Market Size Forecast By Service Type
      6.2.1 Circuit Design
      6.2.2 Layout Design
      6.2.3 Package Design
      6.2.4 Others
   6.3 Market Attractiveness Analysis By Service Type
Chapter 7 Global IC Design Service Market Analysis and Forecast By Enterprise Size
   7.1 Introduction
      7.1.1 Key Market Trends & Growth Opportunities By Enterprise Size
      7.1.2 Basis Point Share (BPS) Analysis By Enterprise Size
      7.1.3 Absolute $ Opportunity Assessment By Enterprise Size
   7.2 IC Design Service Market Size Forecast By Enterprise Size
      7.2.1 Small & Medium Enterprise
      7.2.2 Large Enterprise
   7.3 Market Attractiveness Analysis By Enterprise Size
Chapter 8 Global IC Design Service Market Analysis and Forecast By Application
   8.1 Introduction
      8.1.1 Key Market Trends & Growth Opportunities By Application
      8.1.2 Basis Point Share (BPS) Analysis By Application
      8.1.3 Absolute $ Opportunity Assessment By Application
   8.2 IC Design Service Market Size Forecast By Application
      8.2.1 Microcomponents (MCU/MPU)
      8.2.2 FPGAs
      8.2.3 Memories
      8.2.4 Analog
      8.2.5 Optical sensor
      8.2.6 Non-optical sensors
      8.2.7 Digital ASICs
      8.2.8 Others
   8.3 Market Attractiveness Analysis By Application
Chapter 9 Global IC Design Service Market Analysis and Forecast By End-use Industry
   9.1 Introduction
      9.1.1 Key Market Trends & Growth Opportunities By End-use Industry
      9.1.2 Basis Point Share (BPS) Analysis By End-use Industry
      9.1.3 Absolute $ Opportunity Assessment By End-use Industry
   9.2 IC Design Service Market Size Forecast By End-use Industry
      9.2.1 Communication
         9.2.1.1 Wired communication
         9.2.1.2 Smart Phones
         9.2.1.3 Other Wireless communication
      9.2.2 Consumer Electronics
         9.2.2.1 TV
         9.2.2.2 Wearables
         9.2.2.3 Others
      9.2.3 Automotive
         9.2.3.1 ADAS
         9.2.3.2 Infotainment and Cluster
         9.2.3.3 Body
         9.2.3.4 Chassis
         9.2.3.5 Powertrain
         9.2.3.6 Passive safety
         9.2.3.7 Others
      9.2.4 Computing
         9.2.4.1 Servers
         9.2.4.2 PCs
         9.2.4.3 Others
      9.2.5 Industrial
         9.2.5.1 Security
         9.2.5.2 Automation
         9.2.5.3 Medical/Healthcare
         9.2.5.4 Energy/Power
         9.2.5.5 Solid-State Lightning
         9.2.5.6 Transportation
         9.2.5.7 Others
   9.3 Market Attractiveness Analysis By End-use Industry
Chapter 10 Global IC Design Service Market Analysis and Forecast by Region
   10.1 Introduction
      10.1.1 Key Market Trends & Growth Opportunities by Region
      10.1.2 Basis Point Share (BPS) Analysis by Region
      10.1.3 Absolute $ Opportunity Assessment by Region
   10.2 IC Design Service Market Size Forecast by Region
      10.2.1 North America
      10.2.2 Europe
      10.2.3 Asia Pacific
      10.2.4 Latin America
      10.2.5 Middle East & Africa (MEA)
   10.3 Market Attractiveness Analysis by Region
Chapter 11 Coronavirus Disease (COVID-19) Impact
   11.1 Introduction
   11.2 Current & Future Impact Analysis
   11.3 Economic Impact Analysis
   11.4 Government Policies
   11.5 Investment Scenario
Chapter 12 North America IC Design Service Analysis and Forecast
   12.1 Introduction
   12.2 North America IC Design Service Market Size Forecast by Country
      12.2.1 U.S.
      12.2.2 Canada
   12.3 Basis Point Share (BPS) Analysis by Country
   12.4 Absolute $ Opportunity Assessment by Country
   12.5 Market Attractiveness Analysis by Country
   12.6 North America IC Design Service Market Size Forecast By Type
      12.6.1 Analog IC
      12.6.2 Digital IC
      12.6.3 Mixed IC
   12.7 Basis Point Share (BPS) Analysis By Type
   12.8 Absolute $ Opportunity Assessment By Type
   12.9 Market Attractiveness Analysis By Type
   12.10 North America IC Design Service Market Size Forecast By Service Type
      12.10.1 Circuit Design
      12.10.2 Layout Design
      12.10.3 Package Design
      12.10.4 Others
   12.11 Basis Point Share (BPS) Analysis By Service Type
   12.12 Absolute $ Opportunity Assessment By Service Type
   12.13 Market Attractiveness Analysis By Service Type
   12.14 North America IC Design Service Market Size Forecast By Enterprise Size
      12.14.1 Small & Medium Enterprise
      12.14.2 Large Enterprise
   12.15 Basis Point Share (BPS) Analysis By Enterprise Size
   12.16 Absolute $ Opportunity Assessment By Enterprise Size
   12.17 Market Attractiveness Analysis By Enterprise Size
   12.18 North America IC Design Service Market Size Forecast By Application
      12.18.1 Microcomponents (MCU/MPU)
      12.18.2 FPGAs
      12.18.3 Memories
      12.18.4 Analog
      12.18.5 Optical sensor
      12.18.6 Non-optical sensors
      12.18.7 Digital ASICs
      12.18.8 Others
   12.19 Basis Point Share (BPS) Analysis By Application
   12.20 Absolute $ Opportunity Assessment By Application
   12.21 Market Attractiveness Analysis By Application
   12.22 North America IC Design Service Market Size Forecast By End-use Industry
      12.22.1 Communication
         12.22.1.1 Wired communication
         12.22.1.2 Smart Phones
         12.22.1.3 Other Wireless communication
      12.22.2 Consumer Electronics
         12.22.2.1 TV
         12.22.2.2 Wearables
         12.22.2.3 Others
      12.22.3 Automotive
         12.22.3.1 ADAS
         12.22.3.2 Infotainment and Cluster
         12.22.3.3 Body
         12.22.3.4 Chassis
         12.22.3.5 Powertrain
         12.22.3.6 Passive safety
         12.22.3.7 Others
      12.22.4 Computing
         12.22.4.1 Servers
         12.22.4.2 PCs
         12.22.4.3 Others
      12.22.5 Industrial
         12.22.5.1 Security
         12.22.5.2 Automation
         12.22.5.3 Medical/Healthcare
         12.22.5.4 Energy/Power
         12.22.5.5 Solid-State Lightning
         12.22.5.6 Transportation
         12.22.5.7 Others
   12.23 Basis Point Share (BPS) Analysis By End-use Industry
   12.24 Absolute $ Opportunity Assessment By End-use Industry
   12.25 Market Attractiveness Analysis By End-use Industry
Chapter 13 Europe IC Design Service Analysis and Forecast
   13.1 Introduction
   13.2 Europe IC Design Service Market Size Forecast by Country
      13.2.1 Germany
      13.2.2 France
      13.2.3 Italy
      13.2.4 U.K.
      13.2.5 Spain
      13.2.6 Russia
      13.2.7 Rest of Europe
   13.3 Basis Point Share (BPS) Analysis by Country
   13.4 Absolute $ Opportunity Assessment by Country
   13.5 Market Attractiveness Analysis by Country
   13.6 Europe IC Design Service Market Size Forecast By Type
      13.6.1 Analog IC
      13.6.2 Digital IC
      13.6.3 Mixed IC
   13.7 Basis Point Share (BPS) Analysis By Type
   13.8 Absolute $ Opportunity Assessment By Type
   13.9 Market Attractiveness Analysis By Type
   13.10 Europe IC Design Service Market Size Forecast By Service Type
      13.10.1 Circuit Design
      13.10.2 Layout Design
      13.10.3 Package Design
      13.10.4 Others
   13.11 Basis Point Share (BPS) Analysis By Service Type
   13.12 Absolute $ Opportunity Assessment By Service Type
   13.13 Market Attractiveness Analysis By Service Type
   13.14 Europe IC Design Service Market Size Forecast By Enterprise Size
      13.14.1 Small & Medium Enterprise
      13.14.2 Large Enterprise
   13.15 Basis Point Share (BPS) Analysis By Enterprise Size
   13.16 Absolute $ Opportunity Assessment By Enterprise Size
   13.17 Market Attractiveness Analysis By Enterprise Size
   13.18 Europe IC Design Service Market Size Forecast By Application
      13.18.1 Microcomponents (MCU/MPU)
      13.18.2 FPGAs
      13.18.3 Memories
      13.18.4 Analog
      13.18.5 Optical sensor
      13.18.6 Non-optical sensors
      13.18.7 Digital ASICs
      13.18.8 Others
   13.19 Basis Point Share (BPS) Analysis By Application
   13.20 Absolute $ Opportunity Assessment By Application
   13.21 Market Attractiveness Analysis By Application
   13.22 Europe IC Design Service Market Size Forecast By End-use Industry
      13.22.1 Communication
         13.22.1.1 Wired communication
         13.22.1.2 Smart Phones
         13.22.1.3 Other Wireless communication
      13.22.2 Consumer Electronics
         13.22.2.1 TV
         13.22.2.2 Wearables
         13.22.2.3 Others
      13.22.3 Automotive
         13.22.3.1 ADAS
         13.22.3.2 Infotainment and Cluster
         13.22.3.3 Body
         13.22.3.4 Chassis
         13.22.3.5 Powertrain
         13.22.3.6 Passive safety
         13.22.3.7 Others
      13.22.4 Computing
         13.22.4.1 Servers
         13.22.4.2 PCs
         13.22.4.3 Others
      13.22.5 Industrial
         13.22.5.1 Security
         13.22.5.2 Automation
         13.22.5.3 Medical/Healthcare
         13.22.5.4 Energy/Power
         13.22.5.5 Solid-State Lightning
         13.22.5.6 Transportation
         13.22.5.7 Others
   13.23 Basis Point Share (BPS) Analysis By End-use Industry
   13.24 Absolute $ Opportunity Assessment By End-use Industry
   13.25 Market Attractiveness Analysis By End-use Industry
Chapter 14 Asia Pacific IC Design Service Analysis and Forecast
   14.1 Introduction
   14.2 Asia Pacific IC Design Service Market Size Forecast by Country
      14.2.1 China
      14.2.2 Japan
      14.2.3 South Korea
      14.2.4 India
      14.2.5 Australia
      14.2.6 South East Asia (SEA)
      14.2.7 Rest of Asia Pacific (APAC)
   14.3 Basis Point Share (BPS) Analysis by Country
   14.4 Absolute $ Opportunity Assessment by Country
   14.5 Market Attractiveness Analysis by Country
   14.6 Asia Pacific IC Design Service Market Size Forecast By Type
      14.6.1 Analog IC
      14.6.2 Digital IC
      14.6.3 Mixed IC
   14.7 Basis Point Share (BPS) Analysis By Type
   14.8 Absolute $ Opportunity Assessment By Type
   14.9 Market Attractiveness Analysis By Type
   14.10 Asia Pacific IC Design Service Market Size Forecast By Service Type
      14.10.1 Circuit Design
      14.10.2 Layout Design
      14.10.3 Package Design
      14.10.4 Others
   14.11 Basis Point Share (BPS) Analysis By Service Type
   14.12 Absolute $ Opportunity Assessment By Service Type
   14.13 Market Attractiveness Analysis By Service Type
   14.14 Asia Pacific IC Design Service Market Size Forecast By Enterprise Size
      14.14.1 Small & Medium Enterprise
      14.14.2 Large Enterprise
   14.15 Basis Point Share (BPS) Analysis By Enterprise Size
   14.16 Absolute $ Opportunity Assessment By Enterprise Size
   14.17 Market Attractiveness Analysis By Enterprise Size
   14.18 Asia Pacific IC Design Service Market Size Forecast By Application
      14.18.1 Microcomponents (MCU/MPU)
      14.18.2 FPGAs
      14.18.3 Memories
      14.18.4 Analog
      14.18.5 Optical sensor
      14.18.6 Non-optical sensors
      14.18.7 Digital ASICs
      14.18.8 Others
   14.19 Basis Point Share (BPS) Analysis By Application
   14.20 Absolute $ Opportunity Assessment By Application
   14.21 Market Attractiveness Analysis By Application
   14.22 Asia Pacific IC Design Service Market Size Forecast By End-use Industry
      14.22.1 Communication
         14.22.1.1 Wired communication
         14.22.1.2 Smart Phones
         14.22.1.3 Other Wireless communication
      14.22.2 Consumer Electronics
         14.22.2.1 TV
         14.22.2.2 Wearables
         14.22.2.3 Others
      14.22.3 Automotive
         14.22.3.1 ADAS
         14.22.3.2 Infotainment and Cluster
         14.22.3.3 Body
         14.22.3.4 Chassis
         14.22.3.5 Powertrain
         14.22.3.6 Passive safety
         14.22.3.7 Others
      14.22.4 Computing
         14.22.4.1 Servers
         14.22.4.2 PCs
         14.22.4.3 Others
      14.22.5 Industrial
         14.22.5.1 Security
         14.22.5.2 Automation
         14.22.5.3 Medical/Healthcare
         14.22.5.4 Energy/Power
         14.22.5.5 Solid-State Lightning
         14.22.5.6 Transportation
         14.22.5.7 Others
   14.23 Basis Point Share (BPS) Analysis By End-use Industry
   14.24 Absolute $ Opportunity Assessment By End-use Industry
   14.25 Market Attractiveness Analysis By End-use Industry
Chapter 15 Latin America IC Design Service Analysis and Forecast
   15.1 Introduction
   15.2 Latin America IC Design Service Market Size Forecast by Country
      15.2.1 Brazil
      15.2.2 Mexico
      15.2.3 Rest of Latin America (LATAM)
   15.3 Basis Point Share (BPS) Analysis by Country
   15.4 Absolute $ Opportunity Assessment by Country
   15.5 Market Attractiveness Analysis by Country
   15.6 Latin America IC Design Service Market Size Forecast By Type
      15.6.1 Analog IC
      15.6.2 Digital IC
      15.6.3 Mixed IC
   15.7 Basis Point Share (BPS) Analysis By Type
   15.8 Absolute $ Opportunity Assessment By Type
   15.9 Market Attractiveness Analysis By Type
   15.10 Latin America IC Design Service Market Size Forecast By Service Type
      15.10.1 Circuit Design
      15.10.2 Layout Design
      15.10.3 Package Design
      15.10.4 Others
   15.11 Basis Point Share (BPS) Analysis By Service Type
   15.12 Absolute $ Opportunity Assessment By Service Type
   15.13 Market Attractiveness Analysis By Service Type
   15.14 Latin America IC Design Service Market Size Forecast By Enterprise Size
      15.14.1 Small & Medium Enterprise
      15.14.2 Large Enterprise
   15.15 Basis Point Share (BPS) Analysis By Enterprise Size
   15.16 Absolute $ Opportunity Assessment By Enterprise Size
   15.17 Market Attractiveness Analysis By Enterprise Size
   15.18 Latin America IC Design Service Market Size Forecast By Application
      15.18.1 Microcomponents (MCU/MPU)
      15.18.2 FPGAs
      15.18.3 Memories
      15.18.4 Analog
      15.18.5 Optical sensor
      15.18.6 Non-optical sensors
      15.18.7 Digital ASICs
      15.18.8 Others
   15.19 Basis Point Share (BPS) Analysis By Application
   15.20 Absolute $ Opportunity Assessment By Application
   15.21 Market Attractiveness Analysis By Application
   15.22 Latin America IC Design Service Market Size Forecast By End-use Industry
      15.22.1 Communication
         15.22.1.1 Wired communication
         15.22.1.2 Smart Phones
         15.22.1.3 Other Wireless communication
      15.22.2 Consumer Electronics
         15.22.2.1 TV
         15.22.2.2 Wearables
         15.22.2.3 Others
      15.22.3 Automotive
         15.22.3.1 ADAS
         15.22.3.2 Infotainment and Cluster
         15.22.3.3 Body
         15.22.3.4 Chassis
         15.22.3.5 Powertrain
         15.22.3.6 Passive safety
         15.22.3.7 Others
      15.22.4 Computing
         15.22.4.1 Servers
         15.22.4.2 PCs
         15.22.4.3 Others
      15.22.5 Industrial
         15.22.5.1 Security
         15.22.5.2 Automation
         15.22.5.3 Medical/Healthcare
         15.22.5.4 Energy/Power
         15.22.5.5 Solid-State Lightning
         15.22.5.6 Transportation
         15.22.5.7 Others
   15.23 Basis Point Share (BPS) Analysis By End-use Industry
   15.24 Absolute $ Opportunity Assessment By End-use Industry
   15.25 Market Attractiveness Analysis By End-use Industry
Chapter 16 Middle East & Africa (MEA) IC Design Service Analysis and Forecast
   16.1 Introduction
   16.2 Middle East & Africa (MEA) IC Design Service Market Size Forecast by Country
      16.2.1 Saudi Arabia
      16.2.2 South Africa
      16.2.3 UAE
      16.2.4 Rest of Middle East & Africa (MEA)
   16.3 Basis Point Share (BPS) Analysis by Country
   16.4 Absolute $ Opportunity Assessment by Country
   16.5 Market Attractiveness Analysis by Country
   16.6 Middle East & Africa (MEA) IC Design Service Market Size Forecast By Type
      16.6.1 Analog IC
      16.6.2 Digital IC
      16.6.3 Mixed IC
   16.7 Basis Point Share (BPS) Analysis By Type
   16.8 Absolute $ Opportunity Assessment By Type
   16.9 Market Attractiveness Analysis By Type
   16.10 Middle East & Africa (MEA) IC Design Service Market Size Forecast By Service Type
      16.10.1 Circuit Design
      16.10.2 Layout Design
      16.10.3 Package Design
      16.10.4 Others
   16.11 Basis Point Share (BPS) Analysis By Service Type
   16.12 Absolute $ Opportunity Assessment By Service Type
   16.13 Market Attractiveness Analysis By Service Type
   16.14 Middle East & Africa (MEA) IC Design Service Market Size Forecast By Enterprise Size
      16.14.1 Small & Medium Enterprise
      16.14.2 Large Enterprise
   16.15 Basis Point Share (BPS) Analysis By Enterprise Size
   16.16 Absolute $ Opportunity Assessment By Enterprise Size
   16.17 Market Attractiveness Analysis By Enterprise Size
   16.18 Middle East & Africa (MEA) IC Design Service Market Size Forecast By Application
      16.18.1 Microcomponents (MCU/MPU)
      16.18.2 FPGAs
      16.18.3 Memories
      16.18.4 Analog
      16.18.5 Optical sensor
      16.18.6 Non-optical sensors
      16.18.7 Digital ASICs
      16.18.8 Others
   16.19 Basis Point Share (BPS) Analysis By Application
   16.20 Absolute $ Opportunity Assessment By Application
   16.21 Market Attractiveness Analysis By Application
   16.22 Middle East & Africa (MEA) IC Design Service Market Size Forecast By End-use Industry
      16.22.1 Communication
         16.22.1.1 Wired communication
         16.22.1.2 Smart Phones
         16.22.1.3 Other Wireless communication
      16.22.2 Consumer Electronics
         16.22.2.1 TV
         16.22.2.2 Wearables
         16.22.2.3 Others
      16.22.3 Automotive
         16.22.3.1 ADAS
         16.22.3.2 Infotainment and Cluster
         16.22.3.3 Body
         16.22.3.4 Chassis
         16.22.3.5 Powertrain
         16.22.3.6 Passive safety
         16.22.3.7 Others
      16.22.4 Computing
         16.22.4.1 Servers
         16.22.4.2 PCs
         16.22.4.3 Others
      16.22.5 Industrial
         16.22.5.1 Security
         16.22.5.2 Automation
         16.22.5.3 Medical/Healthcare
         16.22.5.4 Energy/Power
         16.22.5.5 Solid-State Lightning
         16.22.5.6 Transportation
         16.22.5.7 Others
   16.23 Basis Point Share (BPS) Analysis By End-use Industry
   16.24 Absolute $ Opportunity Assessment By End-use Industry
   16.25 Market Attractiveness Analysis By End-use Industry
Chapter 17 Competition Landscape
   17.1 IC Design Service Market: Competitive Dashboard
   17.2 Global IC Design Service Market: Market Share Analysis, 2023
   17.3 Company Profiles (Details – Overview, Financials, Developments, Strategy)
      17.3.1 Synopsys, Inc.
      17.3.2 Cadence Design Systems, Inc.
      17.3.3 SoftBank Group. (Arm Holdings plc.)
      17.3.4 Siemens
      17.3.5 Samsung
      17.3.6 Taiwan Semiconductor Manufacturing Company Limited
      17.3.7 Qualcomm Incorporated.
      17.3.8 MediaTek Inc.
      17.3.9 Texas Instruments Incorporated.
      17.3.10 Microchip Technology Inc.
      17.3.11 Cyient
      17.3.12 Toshiba Information Systems
      17.3.13 ULKASEMI
      17.3.14 Chipus Microelectronics
      17.3.15 ELSYS Design
      17.3.16 ASIC North
      17.3.17 EnSilica
      17.3.18 TEZZARON.
      17.3.19 Akronic, P.C.
      17.3.20 Sondrel
      17.3.21 Device Engineering Inc.

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