High-density Interconnect (HDI) Market

Global High-density Interconnect (HDI) Market by Product (4-6 Layers HDI, 8-10 Layers HDI, 10+ Layers HDI), End-users (Automotive, Consumer Electronics, Telecommunications, Medical, and Others), Applications (Automotive Electronics, Computer and Display, Communication Devices and Equipment, Audio/Audiovisual (AV) Devices, Connected Devices, Wearable Devices, and Others), and Regions (North America, Europe, Latin America, Middle East & Africa, and Asia Pacific), Forecasts 2021-2028

  • Report ID: ICT-SE-4473
  • Author: Growth Market Reports
  • Rating: 4.9
  • Total Reviews: 3
  • No. Of Pages: 177
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The global high-density interconnect (HID) market is anticipated to expand at a CAGR of 12.3% during the forecast period, 2021-2028. HDI is a technology that enables significantly denser PCB building by providing the installation for increasingly smaller components in closer proximity, resulting in shorter routes between components. HDI aids in the reduction of device size and weight and also improves electrical performance.

High-density Interconnect Market Key Takeaways

Market Trends, Drivers, Restraints, and Opportunities

  • Rising demand for smart consumer electronics and wearable devices are some of the key factors driving the growth of the market.
  • Increasing adoption of modern electronics and safety measures in the automotive vertical due to shift toward sophisticated electric/hybrid vehicles, safety systems, and infotainment systems is estimated to drive the market growth.
  • A complex manufacturing process, on the other hand, high building costs, are issues restraining the market growth.
  • Rapid technological advancements and the increased functionality of electronic devices can spur the growth of the market.
  • Rising demand for connected devices to implement IoT and the evolution of 5G technology can create huge opportunities for the high-density interconnect (HDI) market

Scope of the report

The report on the global high-density interconnect (HDI) market includes an assessment of the market scope, analysis, share, competitive analysis, growth facts, restraints, opportunities, and revenue forecast

Attributes

Details

Report Title

High-density Interconnect (HDI) Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast

Base Year

2020

Historic Data

2018–2019

Forecast Period

2021–2028

Segmentation

Product (4-6 Layers HDI, 8-10 Layers HDI, 10+ Layers HDI), End-users (Automotive, Consumer Electronics, Telecommunications, Medical, and Others), Applications (Automotive Electronics, Computer and Display, Communication Devices and Equipment, Audio/Audiovisual (AV) Devices, Connected Devices, Wearable Devices, and Others)

Regional Scope

Asia Pacific, North America, Latin America, Europe, and Middle East & Africa

Report Coverage

Market Scope, Analysis, Share, Competitive Analysis, Growth Facts, Restraints, Opportunities, And Revenue Forecast

Key Players Covered in the Report

Unimicron, Compeq Co., TTM Technologies, Austria Technologie & Systemtechnik, Zhen Ding Tech., IBIDEN, MEIKO ELECTRONICS Co., FUJITSU INTERCONNECT TECHNOLOGIES, Tripod Technology Corp., Unitech, SAMSUNG ELECTRO-MECHANICS, Daeduck GDS Co, DAP Corp., Korea Circuit, CMK, NCAB Group, SIERRA CIRCUITS, and Multek.

Global High-Density Interconnect (HDI) Market segmentation insights

10+ layers HDI segment to exhibit a significant CAGR

Based on products, the market can be segmented into 4-6 Layers HDI, 8-10 Layers HDI, and 10+ Layers HDI. The 10+ layers segment is expected to grow at a significant rate during the forecast period. This growth is due to the application of 10+ layers HDIs in a range of devices, including high-reliability automotive products, high-density mobile devices, and IoT modules. The benefits of 10+ layers HDI include small size, lightweight construction, and increased flexibility.

Medical segment to grow at a rapid pace

On the basis of end-users, the market can be fragmented into automotive, consumer electronics, telecommunications, medical, and others. The medical segment is expected to expand at a high CAGR during the forecast period. The range of HDI PCB applications in the medical market is huge. HDI PCBs are found in pacemakers, defibrillators, cardiac monitors, and medical imaging systems such as MRIs, CT scans, and ultrasonic devices. HDI PCBs are also found in medical devices such as body temperature monitoring, blood glucose monitors, and electrical muscle stimulation devices.

Wearable devices segment to expand at a robust pace

In terms of applications, the market can be classified as automotive electronics, computer and display, communication devices and equipment, audio/audiovisual (AV) devices, connected devices, wearable devices, and others. The wearable electronics segment is expected to grow at a robust pace during the forecast period. HDI PCBs have technical properties of extremely high-density routing connectors, allowing for high component density. These characteristics contribute to HDI boards' high performance and minimal weight, makes them suitable for powering wearable electronics.

Asia Pacific to hold a major market share

Based on regions, the market can be categorized as North America, Europe, Latin America, Middle East & Africa, and Asia Pacific. Asia Pacific is expected to hold a large market share during the forecast period. This growth is due to the growing use of HDI in consumer electronics, automotive, and healthcare verticals in regions such as China, India, and South Korea. It is also the result of the growth of telecommunications networks in China, Thailand, Malaysia, and India.

High-density Interconnect Market By Regions

Segments

By Product
  • 4–6 Layers HDI
  • 8–10 Layers HDI
  • 10+ Layers HDI
By End-users
  • Automotive
  • Consumer Electronics
  • Telecommunications
  • Medical
  • Others
 By Applications
  • Automotive Electronics
  • Computer and Display
  • Communication Devices and Equipment
  • Audio/Audiovisual (AV) Devices
  • Connected Devices
  • Wearable Devices
  • Others
By Regions
  • North America
  • Europe
  • Latin America
  • Middle East & Africa
  • Asia Pacific
By Key Players
  • Unimicron
  • Compeq Co
  • TTM Technologies
  • Austria Technologie & Systemtechnik
  • Zhen Ding Tech
  • IBIDEN
  • MEIKO ELECTRONICS Co
  • FUJITSU INTERCONNECT TECHNOLOGIES
  • Tripod Technology Corp
  • Unitech
  • SAMSUNG ELECTRO-MECHANICS
  • Daeduck GDS Co
  • DAP Corp
  • Korea Circuit
  • CMK
  • NCAB Group
  • SIERRA CIRCUITS
  • Multek

Competitive Landscape

Major players in the HDI market include Unimicron, Compeq Co., TTM Technologies, Austria Technologie & Systemtechnik, Zhen Ding Tech., IBIDEN, MEIKO ELECTRONICS Co., FUJITSU INTERCONNECT TECHNOLOGIES, Tripod Technology Corp., Unitech, SAMSUNG ELECTRO-MECHANICS, Daeduck GDS Co, DAP Corp., Korea Circuit, CMK, NCAB Group, SIERRA CIRCUITS, and Multek.

Unimicron manufactures and sells printed circuit boards (PCBs) and IC carrier products in Taiwan and around the world. Rigid PCBs are available from the company, including HDI boards, layer interconnect (ELIC) or any-layer HDI PCBs, FPCs, multi-layer PCBs, heavy copper PCBs, backpanel/high layer count PCBs, and rigid-flex PCBs. These products are found in a wide variety of devices such as smartphones, tablets, ultrabooks, e-readers, MP3 players, global positioning systems (GPS), portable game consoles, camcorders, and liquid-crystal display (LCD) modules.

The company considers that supplying cutting-edge products helps it to develop in the HDI market. Its purpose is to establish core competencies based on technological innovation and intellectual property. Unimicron has formed alliances with Tier 1 material and equipment providers to this end. The company is involved in product and technology development initiatives at domestic and foreign research institutes; there are collaborative projects with research institutes such as IZM and Georgia Institute of Technology.

High-density Interconnect Market By Key Players

1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. High-density Interconnect (HDI) Market Overview
  4.1. Introduction
     4.1.1. Market Taxonomy
     4.1.2. Market Definition
  4.2. Macro-Economic Factors
     4.2.1. Industry Outlook
  4.3. High-density Interconnect (HDI) Market Dynamics
     4.3.1. Market Drivers
     4.3.2. Market Restraints
     4.3.3. Opportunity
     4.3.4. Market Trends
  4.4. High-density Interconnect (HDI) Market - Supply Chain
  4.5. Global High-density Interconnect (HDI) Market Forecast
     4.5.1. High-density Interconnect (HDI) Market Size (US$ Mn) and Y-o-Y Growth
     4.5.2. High-density Interconnect (HDI) Market Size (000’ Units) and Y-o-Y Growth
     4.5.3. High-density Interconnect (HDI) Market Absolute $ Opportunity
5. Global High-density Interconnect (HDI) Market Analysis and Forecast by Applications
  5.1. Market Trends
  5.2. Introduction
     5.2.1. Basis Point Share (BPS) Analysis by Applications
     5.2.2. Y-o-Y Growth Projections by Applications
  5.3. High-density Interconnect (HDI) Market Size and Volume Forecast by Applications
     5.3.1. Automotive Electronics
     5.3.2. Computer and Display
     5.3.3. Communication Devices and Equipment
     5.3.4. Audio/Audiovisual (AV) Devices
     5.3.5. Connected Devices
     5.3.6. Wearable Devices
     5.3.7. Others
  5.4. Absolute $ Opportunity Assessment by Applications
  5.5. Market Attractiveness/Growth Potential Analysis by Applications
6. Global High-density Interconnect (HDI) Market Analysis and Forecast by End Users
  6.1. Market Trends
  6.2. Introduction
     6.2.1. Basis Point Share (BPS) Analysis by End Users
     6.2.2. Y-o-Y Growth Projections by End Users
  6.3. High-density Interconnect (HDI) Market Size and Volume Forecast by End Users
     6.3.1. Automotive
     6.3.2. Consumer Electronics
     6.3.3. Telecommunications
     6.3.4. Medical
     6.3.5. Others
  6.4. Absolute $ Opportunity Assessment by End Users
  6.5. Market Attractiveness/Growth Potential Analysis by End Users
7. Global High-density Interconnect (HDI) Market Analysis and Forecast by Region
  7.1. Market Trends
  7.2. Introduction
     7.2.1. Basis Point Share (BPS) Analysis by Region
     7.2.2. Y-o-Y Growth Projections by Region
  7.3. High-density Interconnect (HDI) Market Size and Volume Forecast by Region
     7.3.1. North America
     7.3.2. Latin America
     7.3.3. Europe
     7.3.4. Asia Pacific
     7.3.5. Middle East and Africa (MEA)
  7.4. Absolute $ Opportunity Assessment by Region
  7.5. Market Attractiveness/Growth Potential Analysis by Region
  7.6. Global High-density Interconnect (HDI) Demand Share Forecast, 2019-2026
8. North America High-density Interconnect (HDI) Market Analysis and Forecast
  8.1. Introduction
     8.1.1. Basis Point Share (BPS) Analysis by Country
     8.1.2. Y-o-Y Growth Projections by Country
  8.2. North America High-density Interconnect (HDI) Market Size and Volume Forecast by Country
     8.2.1. U.S.
     8.2.2. Canada
  8.3. Absolute $ Opportunity Assessment by Country
  8.4. North America High-density Interconnect (HDI) Market Size and Volume Forecast by Applications
     8.4.1. Automotive Electronics
     8.4.2. Computer and Display
     8.4.3. Communication Devices and Equipment
     8.4.4. Audio/Audiovisual (AV) Devices
     8.4.5. Connected Devices
     8.4.6. Wearable Devices
     8.4.7. Others
  8.5. Basis Point Share (BPS) Analysis by Applications
  8.6. Y-o-Y Growth Projections by Applications
  8.7. North America High-density Interconnect (HDI) Market Size and Volume Forecast by End Users
     8.7.1. Automotive
     8.7.2. Consumer Electronics
     8.7.3. Telecommunications
     8.7.4. Medical
     8.7.5. Others
  8.8. Basis Point Share (BPS) Analysis by End Users
  8.9. Y-o-Y Growth Projections by End Users
  8.10. Market Attractiveness/Growth Potential Analysis
     8.10.1. By Country
     8.10.2. By Product Type
     8.10.3. By Application
  8.11. North America High-density Interconnect (HDI) Demand Share Forecast, 2019-2026
9. Latin America High-density Interconnect (HDI) Market Analysis and Forecast
  9.1. Introduction
     9.1.1. Basis Point Share (BPS) Analysis by Country
     9.1.2. Y-o-Y Growth Projections by Country
     9.1.3. Latin America Average Pricing Analysis
  9.2. Latin America High-density Interconnect (HDI) Market Size and Volume Forecast by Country
      9.2.1. Brazil
      9.2.2. Mexico
      9.2.3. Rest of Latin America
   9.3. Absolute $ Opportunity Assessment by Country
  9.4. Latin America High-density Interconnect (HDI) Market Size and Volume Forecast by Applications
     9.4.1. Automotive Electronics
     9.4.2. Computer and Display
     9.4.3. Communication Devices and Equipment
     9.4.4. Audio/Audiovisual (AV) Devices
     9.4.5. Connected Devices
     9.4.6. Wearable Devices
     9.4.7. Others
  9.5. Basis Point Share (BPS) Analysis by Applications
  9.6. Y-o-Y Growth Projections by Applications
  9.7. Latin America High-density Interconnect (HDI) Market Size and Volume Forecast by End Users
     9.7.1. Automotive
     9.7.2. Consumer Electronics
     9.7.3. Telecommunications
     9.7.4. Medical
     9.7.5. Others
  9.8. Basis Point Share (BPS) Analysis by End Users
  9.9. Y-o-Y Growth Projections by End Users
  9.10. Market Attractiveness/Growth Potential Analysis
     9.10.1. By Country
     9.10.2. By Product Type
     9.10.3. By Application
  9.11. Latin America High-density Interconnect (HDI) Demand Share Forecast, 2019-2026
10. Europe High-density Interconnect (HDI) Market Analysis and Forecast
  10.1. Introduction
     10.1.1. Basis Point Share (BPS) Analysis by Country
     10.1.2. Y-o-Y Growth Projections by Country
     10.1.3. Europe Average Pricing Analysis
  10.2. Europe High-density Interconnect (HDI) Market Size and Volume Forecast by Country
     10.2.1. Germany
     10.2.2. France
     10.2.3. Italy
     10.2.4. U.K.
     10.2.5. Spain
     10.2.6. Russia
     10.2.7. Rest of Europe
  10.3. Absolute $ Opportunity Assessment by Country
  10.4. Europe High-density Interconnect (HDI) Market Size and Volume Forecast by Applications
     10.4.1. Automotive Electronics
     10.4.2. Computer and Display
     10.4.3. Communication Devices and Equipment
     10.4.4. Audio/Audiovisual (AV) Devices
     10.4.5. Connected Devices
     10.4.6. Wearable Devices
     10.4.7. Others
  10.5. Basis Point Share (BPS) Analysis by Applications
  10.6. Y-o-Y Growth Projections by Applications
  10.7. Europe High-density Interconnect (HDI) Market Size and Volume Forecast by End Users
     10.7.1. Automotive
     10.7.2. Consumer Electronics
     10.7.3. Telecommunications
     10.7.4. Medical
     10.7.5. Others
  10.8. Basis Point Share (BPS) Analysis by End Users
  10.9. Y-o-Y Growth Projections by End Users
  10.10. Market Attractiveness/Growth Potential Analysis
     10.10.1. By Country
     10.10.2. By Product Type
     10.10.3. By Application
  10.11. Europe High-density Interconnect (HDI) Demand Share Forecast, 2019-2026
11. Asia Pacific High-density Interconnect (HDI) Market Analysis and Forecast
  11.1. Introduction
     11.1.1. Basis Point Share (BPS) Analysis by Country
     11.1.2. Y-o-Y Growth Projections by Country
     11.1.3. Asia Pacific Average Pricing Analysis
  11.2. Asia Pacific High-density Interconnect (HDI) Market Size and Volume Forecast by Country
     11.2.1. China
     11.2.2. Japan
     11.2.3. South Korea
     11.2.4. India
     11.2.5. Australia
     11.2.6. Rest of Asia Pacific (APAC)
  11.3. Absolute $ Opportunity Assessment by Country
  11.4. Asia Pacific High-density Interconnect (HDI) Market Size and Volume Forecast by Applications
     11.4.1. Automotive Electronics
     11.4.2. Computer and Display
     11.4.3. Communication Devices and Equipment
     11.4.4. Audio/Audiovisual (AV) Devices
     11.4.5. Connected Devices
     11.4.6. Wearable Devices
     11.4.7. Others
  11.5. Basis Point Share (BPS) Analysis by Applications
  11.6. Y-o-Y Growth Projections by Applications
  11.7. Asia Pacific High-density Interconnect (HDI) Market Size and Volume Forecast by End Users
     11.7.1. Automotive
     11.7.2. Consumer Electronics
     11.7.3. Telecommunications
     11.7.4. Medical
     11.7.5. Others
  11.8. Basis Point Share (BPS) Analysis by End Users
  11.9. Y-o-Y Growth Projections by End Users
  11.10. Market Attractiveness/Growth Potential Analysis
     11.10.1. By Country
     11.10.2. By Product Type
     11.10.3. By Application
  11.11. Asia Pacific High-density Interconnect (HDI) Demand Share Forecast, 2019-2026
12. Middle East & Africa High-density Interconnect (HDI) Market Analysis and Forecast
  12.1. Introduction
     12.1.1. Basis Point Share (BPS) Analysis by Country
     12.1.2. Y-o-Y Growth Projections by Country
     12.1.3. Middle East & Africa Average Pricing Analysis
  12.2. Middle East & Africa High-density Interconnect (HDI) Market Size and Volume Forecast by Country
     12.2.1. Saudi Arabia
     12.2.2. South Africa
     12.2.3. UAE
     12.2.4. Rest of Middle East & Africa (MEA)
  12.3. Absolute $ Opportunity Assessment by Country
  12.4. Middle East & Africa High-density Interconnect (HDI) Market Size and Volume Forecast by Applications
     12.4.1. Automotive Electronics
     12.4.2. Computer and Display
     12.4.3. Communication Devices and Equipment
     12.4.4. Audio/Audiovisual (AV) Devices
     12.4.5. Connected Devices
     12.4.6. Wearable Devices
     12.4.7. Others
  12.5. Basis Point Share (BPS) Analysis by Applications
  12.6. Y-o-Y Growth Projections by Applications
  12.7. Middle East & Africa High-density Interconnect (HDI) Market Size and Volume Forecast by End Users
     12.7.1. Automotive
     12.7.2. Consumer Electronics
     12.7.3. Telecommunications
     12.7.4. Medical
     12.7.5. Others
  12.8. Basis Point Share (BPS) Analysis by End Users
  12.9. Y-o-Y Growth Projections by End Users
  12.10. Market Attractiveness/Growth Potential Analysis
     12.10.1. By Country
     12.10.2. By Product Type
     12.10.3. By Application
  12.11. Middle East & Africa High-density Interconnect (HDI) Demand Share Forecast, 2019-2026
13. Competition Landscape
  13.1. Global High-density Interconnect (HDI) Market: Market Share Analysis
  13.2. High-density Interconnect (HDI) Distributors and Customers
  13.3. High-density Interconnect (HDI) Market: Competitive Dashboard
  13.4. Company Profiles (Details: Overview, Financials, Developments, Strategy)
     13.4.1. Unimicron Compeq Co TTM Technologies Austria Technologie & Systemtechnik Zhen Ding Tech IBIDEN  
By Product
  • 4–6 Layers HDI
  • 8–10 Layers HDI
  • 10+ Layers HDI
By End-users
  • Automotive
  • Consumer Electronics
  • Telecommunications
  • Medical
  • Others
 By Applications
  • Automotive Electronics
  • Computer and Display
  • Communication Devices and Equipment
  • Audio/Audiovisual (AV) Devices
  • Connected Devices
  • Wearable Devices
  • Others
By Regions
  • North America
  • Europe
  • Latin America
  • Middle East & Africa
  • Asia Pacific
By Key Players
  • Unimicron
  • Compeq Co
  • TTM Technologies
  • Austria Technologie & Systemtechnik
  • Zhen Ding Tech
  • IBIDEN
  • MEIKO ELECTRONICS Co
  • FUJITSU INTERCONNECT TECHNOLOGIES
  • Tripod Technology Corp
  • Unitech
  • SAMSUNG ELECTRO-MECHANICS
  • Daeduck GDS Co
  • DAP Corp
  • Korea Circuit
  • CMK
  • NCAB Group
  • SIERRA CIRCUITS
  • Multek

Major players in the HDI market include Unimicron, Compeq Co., TTM Technologies, Austria Technologie & Systemtechnik, Zhen Ding Tech., IBIDEN, MEIKO ELECTRONICS Co., FUJITSU INTERCONNECT TECHNOLOGIES, Tripod Technology Corp., Unitech, SAMSUNG ELECTRO-MECHANICS, Daeduck GDS Co, DAP Corp., Korea Circuit, CMK, NCAB Group, SIERRA CIRCUITS, and Multek.

Unimicron manufactures and sells printed circuit boards (PCBs) and IC carrier products in Taiwan and around the world. Rigid PCBs are available from the company, including HDI boards, layer interconnect (ELIC) or any-layer HDI PCBs, FPCs, multi-layer PCBs, heavy copper PCBs, backpanel/high layer count PCBs, and rigid-flex PCBs. These products are found in a wide variety of devices such as smartphones, tablets, ultrabooks, e-readers, MP3 players, global positioning systems (GPS), portable game consoles, camcorders, and liquid-crystal display (LCD) modules.

The company considers that supplying cutting-edge products helps it to develop in the HDI market. Its purpose is to establish core competencies based on technological innovation and intellectual property. Unimicron has formed alliances with Tier 1 material and equipment providers to this end. The company is involved in product and technology development initiatives at domestic and foreign research institutes; there are collaborative projects with research institutes such as IZM and Georgia Institute of Technology.

High-density Interconnect Market By Key Players

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