Flip Chip Technology Market

Flip Chip Technologies Market by Types (Copper Pillar, Solder Bumping, Tin-lead eutectic Solder, Lead-free Solder, Gold Bumping, and Others), Applications (Electronics, Industrial, Automotive &Transport, Healthcare, IT & telecommunication, Aerospace, and Defense), and Regions (Asia Pacific, North America, Latin America, Europe, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2021 – 2028.

  • Report ID: ICT-SE-619
  • Author: Growth Market Reports
  • Rating: 4.9
  • Total Reviews: 2
  • No. Of Pages: 140
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The global flip chip market size is expected to reach USD 36.7 billion by 2028, rising at a CAGR of 8.2% during the forecast period. Growth of the market is attributed to growing demand for high connectivity devices, retaining high package density and increasing circuit durability.

Flip Chip Technologies Market Key Takeaways

Flip chip technology is currently undergoing a high growth owing to the advancement of copper pillar and micro bumping metallurgy and its extensive application in consumer electronic and mobile phones. Bumping methods support advanced manufacturing techniques, such that the flip chip process can be modified to meet new challenges. The increased performance capability of flip chip technology has become a commonly recognized high-range and medium-range technology. Rise in demand for computer, wireless mobiles, and consumer applications are driving the market for flip-chip technology. 2.5D IC and 3D IC packaging technology are trending these days. The consumer market holds major share of flip chip market. Demand for raw materials has increased by the manufacturers producing new technologies for bumping process. This leads to the aggressive growth in this business among the raw material market players. IT and other industries affiliated to is going through a significant change. Several industries prefer flip chips as these have higher efficiency over the traditional mechanism and lasts longer.

Market Trends, Drivers, Restraints, and Opportunities

  • Rising bumping solutions are projected to boost the market during the forecast period.
  • Rapid growth of consumer electronics is the major factor driving the market.
  • High price of the product is anticipated to hamper the market growth.
  • R&D investment and technological advancement in flip chip technology is estimated to create immense opportunities for the market players.

Scope of the Report

The report on the global flip chip technology market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.

Attributes

Details

Report Title

Flip Chip Technology Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast

Base Year

2020

Historic Data

2018–2019

Forecast Period

2021–2028

Segmentation

Types (Copper Pillar, Solder Bumping, Tin-lead eutectic Solder, Lead-free Solder, Gold Bumping, and Others), Applications (Electronics, Industrial, Automotive &Transport, Healthcare, IT & telecommunication, Aerospace, Defense, and Others),

Regional Scope

Asia Pacific, North America, Latin America, Europe, and Middle East & Africa

Report Coverage

Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast

Key Players Covered in the Report

Samsung Electronica’s group, Powertech Technology, United Microelectronics Corporation, Intel Corporation, Amkor Technology, TSMC, Jiangsu Changjiang Electronics Technology, Texas Instruments, and Siliconware Precision Industries.


Market Segment Insights:

The copper pillar segment is anticipated to hold major market share
Based on types, the global flip chip technology market is fragmented as copper pillar solder bumping, tin-lead eutectic solder, lead-free solder, and gold bumping, other. Growth of the copper pillar segment is attributed to advancement of copper bumping metallurgy and its wide applications. .The copper pillar has effective pitch of 80 μm and appears to be a promising approach down to pitches of 40 μm. Copper pillar technology was patented by IBM in 2001, in the form of a metal post attached by solder to the silicon and substrate pads. This technology is currently used by mobile companies.

Flip Chip Technologies Market By Types

The IT & telecommunication segment is estimated to hold major market share during the forecast period
On the basis of applications, the global flip chip technology market is segregated into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace, and defense. These chips are used as the core part of the products. Flip chip has driven the above-mentioned industries over a period of time. It has gradually replaced wire bonding packaging, owing to their enhanced features such as compact size, rugged structure, improved efficiency, and high frequency application at low cost.

Flip Chip Technologies Market By Applications

The market in Asia Pacific is projected to hold a major market share
In terms of regions, the global flip chip technologies market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. Asia-Pacific accounts for a major market share of more than 35.8% of the total revenue. Presence of major players in countries such as India and China are expected to propel the regional market. Increasing demand for consumer electronics such as smartphones, tablets, and wearable electronics like smart watches and fitness bands is driving the market growth.

1. Executive Summary
2. Assumptions and Acronyms Used
3. Research Methodology
4. Flip Chip Technology Market Overview
  4.1. Introduction
     4.1.1. Market Taxonomy
     4.1.2. Market Definition
  4.2. Macro-Economic Factors
     4.2.1. Industry Outlook
  4.3. Flip Chip Technology Market Dynamics
     4.3.1. Market Drivers
     4.3.2. Market Restraints
     4.3.3. Opportunity
     4.3.4. Market Trends
  4.4. Flip Chip Technology Market - Supply Chain
  4.5. Global Flip Chip Technology Market Forecast
     4.5.1. Flip Chip Technology Market Size (US$ Mn) and Y-o-Y Growth
     4.5.2. Flip Chip Technology Market Size (000’ Units) and Y-o-Y Growth
     4.5.3. Flip Chip Technology Market Absolute $ Opportunity
5. Global Flip Chip Technology Market Analysis and Forecast by Types
  5.1. Market Trends
  5.2. Introduction
     5.2.1. Basis Point Share (BPS) Analysis by Types
     5.2.2. Y-o-Y Growth Projections by Types
  5.3. Flip Chip Technology Market Size and Volume Forecast by Types
     5.3.1. Copper Pillar
     5.3.2. Solder Bumping
     5.3.3. Tin-lead eutectic solder
     5.3.4. Lead-free solder
     5.3.5. Gold Bumping
     5.3.6. Others
  5.4. Absolute $ Opportunity Assessment by Types
  5.5. Market Attractiveness/Growth Potential Analysis by Types
6. Global Flip Chip Technology Market Analysis and Forecast by Applications
  6.1. Market Trends
  6.2. Introduction
     6.2.1. Basis Point Share (BPS) Analysis by Applications
     6.2.2. Y-o-Y Growth Projections by Applications
  6.3. Flip Chip Technology Market Size and Volume Forecast by Applications
     6.3.1. Electronics
     6.3.2. Industrial
     6.3.3. Automotive &Transport
     6.3.4. Healthcare
     6.3.5. IT & telecommunication
     6.3.6. Aerospace and Defense
  6.4. Absolute $ Opportunity Assessment by Applications
  6.5. Market Attractiveness/Growth Potential Analysis by Applications
7. Global Flip Chip Technology Market Analysis and Forecast by Region
  7.1. Market Trends
  7.2. Introduction
     7.2.1. Basis Point Share (BPS) Analysis by Region
     7.2.2. Y-o-Y Growth Projections by Region
  7.3. Flip Chip Technology Market Size and Volume Forecast by Region
     7.3.1. North America
     7.3.2. Latin America
     7.3.3. Europe
     7.3.4. Asia Pacific
     7.3.5. Middle East and Africa (MEA)
  7.4. Absolute $ Opportunity Assessment by Region
  7.5. Market Attractiveness/Growth Potential Analysis by Region
  7.6. Global Flip Chip Technology Demand Share Forecast, 2019-2026
8. North America Flip Chip Technology Market Analysis and Forecast
  8.1. Introduction
     8.1.1. Basis Point Share (BPS) Analysis by Country
     8.1.2. Y-o-Y Growth Projections by Country
  8.2. North America Flip Chip Technology Market Size and Volume Forecast by Country
     8.2.1. U.S.
     8.2.2. Canada
  8.3. Absolute $ Opportunity Assessment by Country
  8.4. North America Flip Chip Technology Market Size and Volume Forecast by Types
     8.4.1. Copper Pillar
     8.4.2. Solder Bumping
     8.4.3. Tin-lead eutectic solder
     8.4.4. Lead-free solder
     8.4.5. Gold Bumping
     8.4.6. Others
  8.5. Basis Point Share (BPS) Analysis by Types
  8.6. Y-o-Y Growth Projections by Types
  8.7. North America Flip Chip Technology Market Size and Volume Forecast by Applications
     8.7.1. Electronics
     8.7.2. Industrial
     8.7.3. Automotive &Transport
     8.7.4. Healthcare
     8.7.5. IT & telecommunication
     8.7.6. Aerospace and Defense
  8.8. Basis Point Share (BPS) Analysis by Applications
  8.9. Y-o-Y Growth Projections by Applications
  8.10. Market Attractiveness/Growth Potential Analysis
     8.10.1. By Country
     8.10.2. By Product Type
     8.10.3. By Application
  8.11. North America Flip Chip Technology Demand Share Forecast, 2019-2026
9. Latin America Flip Chip Technology Market Analysis and Forecast
  9.1. Introduction
     9.1.1. Basis Point Share (BPS) Analysis by Country
     9.1.2. Y-o-Y Growth Projections by Country
     9.1.3. Latin America Average Pricing Analysis
  9.2. Latin America Flip Chip Technology Market Size and Volume Forecast by Country
      9.2.1. Brazil
      9.2.2. Mexico
      9.2.3. Rest of Latin America
   9.3. Absolute $ Opportunity Assessment by Country
  9.4. Latin America Flip Chip Technology Market Size and Volume Forecast by Types
     9.4.1. Copper Pillar
     9.4.2. Solder Bumping
     9.4.3. Tin-lead eutectic solder
     9.4.4. Lead-free solder
     9.4.5. Gold Bumping
     9.4.6. Others
  9.5. Basis Point Share (BPS) Analysis by Types
  9.6. Y-o-Y Growth Projections by Types
  9.7. Latin America Flip Chip Technology Market Size and Volume Forecast by Applications
     9.7.1. Electronics
     9.7.2. Industrial
     9.7.3. Automotive &Transport
     9.7.4. Healthcare
     9.7.5. IT & telecommunication
     9.7.6. Aerospace and Defense
  9.8. Basis Point Share (BPS) Analysis by Applications
  9.9. Y-o-Y Growth Projections by Applications
  9.10. Market Attractiveness/Growth Potential Analysis
     9.10.1. By Country
     9.10.2. By Product Type
     9.10.3. By Application
  9.11. Latin America Flip Chip Technology Demand Share Forecast, 2019-2026
10. Europe Flip Chip Technology Market Analysis and Forecast
  10.1. Introduction
     10.1.1. Basis Point Share (BPS) Analysis by Country
     10.1.2. Y-o-Y Growth Projections by Country
     10.1.3. Europe Average Pricing Analysis
  10.2. Europe Flip Chip Technology Market Size and Volume Forecast by Country
     10.2.1. Germany
     10.2.2. France
     10.2.3. Italy
     10.2.4. U.K.
     10.2.5. Spain
     10.2.6. Russia
     10.2.7. Rest of Europe
  10.3. Absolute $ Opportunity Assessment by Country
  10.4. Europe Flip Chip Technology Market Size and Volume Forecast by Types
     10.4.1. Copper Pillar
     10.4.2. Solder Bumping
     10.4.3. Tin-lead eutectic solder
     10.4.4. Lead-free solder
     10.4.5. Gold Bumping
     10.4.6. Others
  10.5. Basis Point Share (BPS) Analysis by Types
  10.6. Y-o-Y Growth Projections by Types
  10.7. Europe Flip Chip Technology Market Size and Volume Forecast by Applications
     10.7.1. Electronics
     10.7.2. Industrial
     10.7.3. Automotive &Transport
     10.7.4. Healthcare
     10.7.5. IT & telecommunication
     10.7.6. Aerospace and Defense
  10.8. Basis Point Share (BPS) Analysis by Applications
  10.9. Y-o-Y Growth Projections by Applications
  10.10. Market Attractiveness/Growth Potential Analysis
     10.10.1. By Country
     10.10.2. By Product Type
     10.10.3. By Application
  10.11. Europe Flip Chip Technology Demand Share Forecast, 2019-2026
11. Asia Pacific Flip Chip Technology Market Analysis and Forecast
  11.1. Introduction
     11.1.1. Basis Point Share (BPS) Analysis by Country
     11.1.2. Y-o-Y Growth Projections by Country
     11.1.3. Asia Pacific Average Pricing Analysis
  11.2. Asia Pacific Flip Chip Technology Market Size and Volume Forecast by Country
     11.2.1. China
     11.2.2. Japan
     11.2.3. South Korea
     11.2.4. India
     11.2.5. Australia
     11.2.6. Rest of Asia Pacific (APAC)
  11.3. Absolute $ Opportunity Assessment by Country
  11.4. Asia Pacific Flip Chip Technology Market Size and Volume Forecast by Types
     11.4.1. Copper Pillar
     11.4.2. Solder Bumping
     11.4.3. Tin-lead eutectic solder
     11.4.4. Lead-free solder
     11.4.5. Gold Bumping
     11.4.6. Others
  11.5. Basis Point Share (BPS) Analysis by Types
  11.6. Y-o-Y Growth Projections by Types
  11.7. Asia Pacific Flip Chip Technology Market Size and Volume Forecast by Applications
     11.7.1. Electronics
     11.7.2. Industrial
     11.7.3. Automotive &Transport
     11.7.4. Healthcare
     11.7.5. IT & telecommunication
     11.7.6. Aerospace and Defense
  11.8. Basis Point Share (BPS) Analysis by Applications
  11.9. Y-o-Y Growth Projections by Applications
  11.10. Market Attractiveness/Growth Potential Analysis
     11.10.1. By Country
     11.10.2. By Product Type
     11.10.3. By Application
  11.11. Asia Pacific Flip Chip Technology Demand Share Forecast, 2019-2026
12. Middle East & Africa Flip Chip Technology Market Analysis and Forecast
  12.1. Introduction
     12.1.1. Basis Point Share (BPS) Analysis by Country
     12.1.2. Y-o-Y Growth Projections by Country
     12.1.3. Middle East & Africa Average Pricing Analysis
  12.2. Middle East & Africa Flip Chip Technology Market Size and Volume Forecast by Country
     12.2.1. Saudi Arabia
     12.2.2. South Africa
     12.2.3. UAE
     12.2.4. Rest of Middle East & Africa (MEA)
  12.3. Absolute $ Opportunity Assessment by Country
  12.4. Middle East & Africa Flip Chip Technology Market Size and Volume Forecast by Types
     12.4.1. Copper Pillar
     12.4.2. Solder Bumping
     12.4.3. Tin-lead eutectic solder
     12.4.4. Lead-free solder
     12.4.5. Gold Bumping
     12.4.6. Others
  12.5. Basis Point Share (BPS) Analysis by Types
  12.6. Y-o-Y Growth Projections by Types
  12.7. Middle East & Africa Flip Chip Technology Market Size and Volume Forecast by Applications
     12.7.1. Electronics
     12.7.2. Industrial
     12.7.3. Automotive &Transport
     12.7.4. Healthcare
     12.7.5. IT & telecommunication
     12.7.6. Aerospace and Defense
  12.8. Basis Point Share (BPS) Analysis by Applications
  12.9. Y-o-Y Growth Projections by Applications
  12.10. Market Attractiveness/Growth Potential Analysis
     12.10.1. By Country
     12.10.2. By Product Type
     12.10.3. By Application
  12.11. Middle East & Africa Flip Chip Technology Demand Share Forecast, 2019-2026
13. Competition Landscape
  13.1. Global Flip Chip Technology Market: Market Share Analysis
  13.2. Flip Chip Technology Distributors and Customers
  13.3. Flip Chip Technology Market: Competitive Dashboard
  13.4. Company Profiles (Details: Overview, Financials, Developments, Strategy)
     13.4.1. Samsung Electronics
     13.4.2. ASE group
     13.4.3. Powertech Technology
     13.4.4. United Microelectronics Corporation
     13.4.5. Intel Corporation
     13.4.6. Amkor Technology
     13.4.7. TSMC
     13.4.8. Jiangsu Changjiang Electronics Technology
     13.4.9. Texas Instruments
     13.4.10. Siliconware Precision Industries
Segments Covered in the Report
The global flip chip technologies market is segmented on the basis of

Type
  • Copper Pillar
  • Solder Bumping
  • Tin-lead eutectic solder
  • Lead-free solder
  • Gold Bumping
  • Others
Applications
  • Electronics
  • Industrial
  • Automotive &Transport
  • Healthcare
  • IT & telecommunication
  • Aerospace and Defense
Regions
  • Asia Pacific
  • North America
  • Latin America
  • Europe
  • Middle East & Africa
Key Players
  • Samsung Electronics
  • ASE group
  • Powertech Technology
  • United Microelectronics Corporation
  • Intel Corporation
  • Amkor Technology
  • TSMC
  • Jiangsu Changjiang Electronics Technology
  • Texas Instruments
  • Siliconware Precision Industries

Key players in the global the flip chip market include Samsung Electronica’s group, Powertech Technology, United Microelectronics Corporation, Intel Corporation, Amkor Technology, TSMC, Jiangsu Changjiang Electronics Technology, Texas Instruments, and Siliconware Precision Industries. These companies are neck to neck in providing their consumers with top end products with better quality and price. Several business strategies adopted by the major players include mergers, acquisitions, partnerships, collaborations, capacity expansion, and product launches to increase their market shares. The flip chip market is affected by covid -19 pandemic and the producers are facing losses due to the partial or full lockdown. Flip chip technology can be applied to applications such as processor, baseband, PMIC, and memory devices. Flip chip technology is widely used in many areas such as consumer electronics, automotive, telecommunications, industrial, medical devices, military & aerospace, and others.

 Flip Chip Technologies Market By Key Players

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