Flip Chip Technology Market Size, Share & Growth Report 2031
Flip Chip Technology Market Size, Share & Growth Report 2031
Segments - Flip Chip Technologies Market by Types (Copper Pillar, Solder Bumping, Tin-lead eutectic Solder, Lead-free Solder, Gold Bumping, and Others), Applications (Electronics, Industrial, Automotive &Transport, Healthcare, IT & telecommunication, Aerospace, and Defense), and Regions (Asia Pacific, North America, Latin America, Europe, and Middle East & Africa) - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast 2021 – 2028.
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| Report ID :ICT-SE-619
| 4.7 Rating
| 77 Reviews
| 140 Pages
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Report Description
The global flip chip market size is expected to reach USD 36.7 billion by 2028, rising at a CAGR of 8.2% during the forecast period. Growth of the market is attributed to growing demand for high connectivity devices, retaining high package density and increasing circuit durability.
Flip chip technology is currently undergoing a high growth owing to the advancement of copper pillar and micro bumping metallurgy and its extensive application in consumer electronic and mobile phones. Bumping methods support advanced manufacturing techniques, such that the flip chip process can be modified to meet new challenges. The increased performance capability of flip chip technology has become a commonly recognized high-range and medium-range technology. Rise in demand for computer, wireless mobiles, and consumer applications are driving the market for flip-chip technology. 2.5D IC and 3D IC packaging technology are trending these days. The consumer market holds major share of flip chip market. Demand for raw materials has increased by the manufacturers producing new technologies for bumping process. This leads to the aggressive growth in this business among the raw material market players. IT and other industries affiliated to is going through a significant change. Several industries prefer flip chips as these have higher efficiency over the traditional mechanism and lasts longer.
Market Trends, Drivers, Restraints, and Opportunities
- Rising bumping solutions are projected to boost the market during the forecast period.
- Rapid growth of consumer electronics is the major factor driving the market.
- High price of the product is anticipated to hamper the market growth.
- R&D investment and technological advancement in flip chip technology is estimated to create immense opportunities for the market players.
Scope of the Report
The report on the global flip chip technology market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.
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Attributes |
Details |
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Report Title |
Flip Chip Technology Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast |
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Base Year |
2020 |
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Historic Data |
2018–2019 |
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Forecast Period |
2021–2028 |
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Segmentation |
Types (Copper Pillar, Solder Bumping, Tin-lead eutectic Solder, Lead-free Solder, Gold Bumping, and Others), Applications (Electronics, Industrial, Automotive &Transport, Healthcare, IT & telecommunication, Aerospace, Defense, and Others), |
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Regional Scope |
Asia Pacific, North America, Latin America, Europe, and Middle East & Africa |
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Report Coverage |
Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast |
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Key Players Covered in the Report |
Samsung Electronica’s group, Powertech Technology, United Microelectronics Corporation, Intel Corporation, Amkor Technology, TSMC, Jiangsu Changjiang Electronics Technology, Texas Instruments, and Siliconware Precision Industries. |
Market Segment Insights:
The copper pillar segment is anticipated to hold major market share
Based on types, the global flip chip technology market is fragmented as copper pillar solder bumping, tin-lead eutectic solder, lead-free solder, and gold bumping, other. Growth of the copper pillar segment is attributed to advancement of copper bumping metallurgy and its wide applications. .The copper pillar has effective pitch of 80 μm and appears to be a promising approach down to pitches of 40 μm. Copper pillar technology was patented by IBM in 2001, in the form of a metal post attached by solder to the silicon and substrate pads. This technology is currently used by mobile companies.
The IT & telecommunication segment is estimated to hold major market share during the forecast period
On the basis of applications, the global flip chip technology market is segregated into electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace, and defense. These chips are used as the core part of the products. Flip chip has driven the above-mentioned industries over a period of time. It has gradually replaced wire bonding packaging, owing to their enhanced features such as compact size, rugged structure, improved efficiency, and high frequency application at low cost.
The market in Asia Pacific is projected to hold a major market share
In terms of regions, the global flip chip technologies market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. Asia-Pacific accounts for a major market share of more than 35.8% of the total revenue. Presence of major players in countries such as India and China are expected to propel the regional market. Increasing demand for consumer electronics such as smartphones, tablets, and wearable electronics like smart watches and fitness bands is driving the market growth.
Segments
Segments Covered in the ReportThe global flip chip technologies market is segmented on the basis of
Type
- Copper Pillar
- Solder Bumping
- Tin-lead eutectic solder
- Lead-free solder
- Gold Bumping
- Others
- Electronics
- Industrial
- Automotive &Transport
- Healthcare
- IT & telecommunication
- Aerospace and Defense
- Asia Pacific
- North America
- Latin America
- Europe
- Middle East & Africa
- Samsung Electronics
- ASE group
- Powertech Technology
- United Microelectronics Corporation
- Intel Corporation
- Amkor Technology
- TSMC
- Jiangsu Changjiang Electronics Technology
- Texas Instruments
- Siliconware Precision Industries
Competitive Landscape
Key players in the global the flip chip market include Samsung Electronica’s group, Powertech Technology, United Microelectronics Corporation, Intel Corporation, Amkor Technology, TSMC, Jiangsu Changjiang Electronics Technology, Texas Instruments, and Siliconware Precision Industries. These companies are neck to neck in providing their consumers with top end products with better quality and price. Several business strategies adopted by the major players include mergers, acquisitions, partnerships, collaborations, capacity expansion, and product launches to increase their market shares. The flip chip market is affected by covid -19 pandemic and the producers are facing losses due to the partial or full lockdown. Flip chip technology can be applied to applications such as processor, baseband, PMIC, and memory devices. Flip chip technology is widely used in many areas such as consumer electronics, automotive, telecommunications, industrial, medical devices, military & aerospace, and others.
Table Of Content
1. Executive Summary2. Assumptions and Acronyms Used
3. Research Methodology
4. Flip Chip Technology Market Overview
4.1. Introduction
4.1.1. Market Taxonomy
4.1.2. Market Definition
4.2. Macro-Economic Factors
4.2.1. Industry Outlook
4.3. Flip Chip Technology Market Dynamics
4.3.1. Market Drivers
4.3.2. Market Restraints
4.3.3. Opportunity
4.3.4. Market Trends
4.4. Flip Chip Technology Market - Supply Chain
4.5. Global Flip Chip Technology Market Forecast
4.5.1. Flip Chip Technology Market Size (US$ Mn) and Y-o-Y Growth
4.5.2. Flip Chip Technology Market Size (000’ Units) and Y-o-Y Growth
4.5.3. Flip Chip Technology Market Absolute $ Opportunity
5. Global Flip Chip Technology Market Analysis and Forecast by Types
5.1. Market Trends
5.2. Introduction
5.2.1. Basis Point Share (BPS) Analysis by Types
5.2.2. Y-o-Y Growth Projections by Types
5.3. Flip Chip Technology Market Size and Volume Forecast by Types
5.3.1. Copper Pillar
5.3.2. Solder Bumping
5.3.3. Tin-lead eutectic solder
5.3.4. Lead-free solder
5.3.5. Gold Bumping
5.3.6. Others
5.4. Absolute $ Opportunity Assessment by Types
5.5. Market Attractiveness/Growth Potential Analysis by Types
6. Global Flip Chip Technology Market Analysis and Forecast by Applications
6.1. Market Trends
6.2. Introduction
6.2.1. Basis Point Share (BPS) Analysis by Applications
6.2.2. Y-o-Y Growth Projections by Applications
6.3. Flip Chip Technology Market Size and Volume Forecast by Applications
6.3.1. Electronics
6.3.2. Industrial
6.3.3. Automotive &Transport
6.3.4. Healthcare
6.3.5. IT & telecommunication
6.3.6. Aerospace and Defense
6.4. Absolute $ Opportunity Assessment by Applications
6.5. Market Attractiveness/Growth Potential Analysis by Applications
7. Global Flip Chip Technology Market Analysis and Forecast by Region
7.1. Market Trends
7.2. Introduction
7.2.1. Basis Point Share (BPS) Analysis by Region
7.2.2. Y-o-Y Growth Projections by Region
7.3. Flip Chip Technology Market Size and Volume Forecast by Region
7.3.1. North America
7.3.2. Latin America
7.3.3. Europe
7.3.4. Asia Pacific
7.3.5. Middle East and Africa (MEA)
7.4. Absolute $ Opportunity Assessment by Region
7.5. Market Attractiveness/Growth Potential Analysis by Region
7.6. Global Flip Chip Technology Demand Share Forecast, 2019-2026
8. North America Flip Chip Technology Market Analysis and Forecast
8.1. Introduction
8.1.1. Basis Point Share (BPS) Analysis by Country
8.1.2. Y-o-Y Growth Projections by Country
8.2. North America Flip Chip Technology Market Size and Volume Forecast by Country
8.2.1. U.S.
8.2.2. Canada
8.3. Absolute $ Opportunity Assessment by Country
8.4. North America Flip Chip Technology Market Size and Volume Forecast by Types
8.4.1. Copper Pillar
8.4.2. Solder Bumping
8.4.3. Tin-lead eutectic solder
8.4.4. Lead-free solder
8.4.5. Gold Bumping
8.4.6. Others
8.5. Basis Point Share (BPS) Analysis by Types
8.6. Y-o-Y Growth Projections by Types
8.7. North America Flip Chip Technology Market Size and Volume Forecast by Applications
8.7.1. Electronics
8.7.2. Industrial
8.7.3. Automotive &Transport
8.7.4. Healthcare
8.7.5. IT & telecommunication
8.7.6. Aerospace and Defense
8.8. Basis Point Share (BPS) Analysis by Applications
8.9. Y-o-Y Growth Projections by Applications
8.10. Market Attractiveness/Growth Potential Analysis
8.10.1. By Country
8.10.2. By Product Type
8.10.3. By Application
8.11. North America Flip Chip Technology Demand Share Forecast, 2019-2026
9. Latin America Flip Chip Technology Market Analysis and Forecast
9.1. Introduction
9.1.1. Basis Point Share (BPS) Analysis by Country
9.1.2. Y-o-Y Growth Projections by Country
9.1.3. Latin America Average Pricing Analysis
9.2. Latin America Flip Chip Technology Market Size and Volume Forecast by Country
9.2.1. Brazil
9.2.2. Mexico
9.2.3. Rest of Latin America
9.3. Absolute $ Opportunity Assessment by Country
9.4. Latin America Flip Chip Technology Market Size and Volume Forecast by Types
9.4.1. Copper Pillar
9.4.2. Solder Bumping
9.4.3. Tin-lead eutectic solder
9.4.4. Lead-free solder
9.4.5. Gold Bumping
9.4.6. Others
9.5. Basis Point Share (BPS) Analysis by Types
9.6. Y-o-Y Growth Projections by Types
9.7. Latin America Flip Chip Technology Market Size and Volume Forecast by Applications
9.7.1. Electronics
9.7.2. Industrial
9.7.3. Automotive &Transport
9.7.4. Healthcare
9.7.5. IT & telecommunication
9.7.6. Aerospace and Defense
9.8. Basis Point Share (BPS) Analysis by Applications
9.9. Y-o-Y Growth Projections by Applications
9.10. Market Attractiveness/Growth Potential Analysis
9.10.1. By Country
9.10.2. By Product Type
9.10.3. By Application
9.11. Latin America Flip Chip Technology Demand Share Forecast, 2019-2026
10. Europe Flip Chip Technology Market Analysis and Forecast
10.1. Introduction
10.1.1. Basis Point Share (BPS) Analysis by Country
10.1.2. Y-o-Y Growth Projections by Country
10.1.3. Europe Average Pricing Analysis
10.2. Europe Flip Chip Technology Market Size and Volume Forecast by Country
10.2.1. Germany
10.2.2. France
10.2.3. Italy
10.2.4. U.K.
10.2.5. Spain
10.2.6. Russia
10.2.7. Rest of Europe
10.3. Absolute $ Opportunity Assessment by Country
10.4. Europe Flip Chip Technology Market Size and Volume Forecast by Types
10.4.1. Copper Pillar
10.4.2. Solder Bumping
10.4.3. Tin-lead eutectic solder
10.4.4. Lead-free solder
10.4.5. Gold Bumping
10.4.6. Others
10.5. Basis Point Share (BPS) Analysis by Types
10.6. Y-o-Y Growth Projections by Types
10.7. Europe Flip Chip Technology Market Size and Volume Forecast by Applications
10.7.1. Electronics
10.7.2. Industrial
10.7.3. Automotive &Transport
10.7.4. Healthcare
10.7.5. IT & telecommunication
10.7.6. Aerospace and Defense
10.8. Basis Point Share (BPS) Analysis by Applications
10.9. Y-o-Y Growth Projections by Applications
10.10. Market Attractiveness/Growth Potential Analysis
10.10.1. By Country
10.10.2. By Product Type
10.10.3. By Application
10.11. Europe Flip Chip Technology Demand Share Forecast, 2019-2026
11. Asia Pacific Flip Chip Technology Market Analysis and Forecast
11.1. Introduction
11.1.1. Basis Point Share (BPS) Analysis by Country
11.1.2. Y-o-Y Growth Projections by Country
11.1.3. Asia Pacific Average Pricing Analysis
11.2. Asia Pacific Flip Chip Technology Market Size and Volume Forecast by Country
11.2.1. China
11.2.2. Japan
11.2.3. South Korea
11.2.4. India
11.2.5. Australia
11.2.6. Rest of Asia Pacific (APAC)
11.3. Absolute $ Opportunity Assessment by Country
11.4. Asia Pacific Flip Chip Technology Market Size and Volume Forecast by Types
11.4.1. Copper Pillar
11.4.2. Solder Bumping
11.4.3. Tin-lead eutectic solder
11.4.4. Lead-free solder
11.4.5. Gold Bumping
11.4.6. Others
11.5. Basis Point Share (BPS) Analysis by Types
11.6. Y-o-Y Growth Projections by Types
11.7. Asia Pacific Flip Chip Technology Market Size and Volume Forecast by Applications
11.7.1. Electronics
11.7.2. Industrial
11.7.3. Automotive &Transport
11.7.4. Healthcare
11.7.5. IT & telecommunication
11.7.6. Aerospace and Defense
11.8. Basis Point Share (BPS) Analysis by Applications
11.9. Y-o-Y Growth Projections by Applications
11.10. Market Attractiveness/Growth Potential Analysis
11.10.1. By Country
11.10.2. By Product Type
11.10.3. By Application
11.11. Asia Pacific Flip Chip Technology Demand Share Forecast, 2019-2026
12. Middle East & Africa Flip Chip Technology Market Analysis and Forecast
12.1. Introduction
12.1.1. Basis Point Share (BPS) Analysis by Country
12.1.2. Y-o-Y Growth Projections by Country
12.1.3. Middle East & Africa Average Pricing Analysis
12.2. Middle East & Africa Flip Chip Technology Market Size and Volume Forecast by Country
12.2.1. Saudi Arabia
12.2.2. South Africa
12.2.3. UAE
12.2.4. Rest of Middle East & Africa (MEA)
12.3. Absolute $ Opportunity Assessment by Country
12.4. Middle East & Africa Flip Chip Technology Market Size and Volume Forecast by Types
12.4.1. Copper Pillar
12.4.2. Solder Bumping
12.4.3. Tin-lead eutectic solder
12.4.4. Lead-free solder
12.4.5. Gold Bumping
12.4.6. Others
12.5. Basis Point Share (BPS) Analysis by Types
12.6. Y-o-Y Growth Projections by Types
12.7. Middle East & Africa Flip Chip Technology Market Size and Volume Forecast by Applications
12.7.1. Electronics
12.7.2. Industrial
12.7.3. Automotive &Transport
12.7.4. Healthcare
12.7.5. IT & telecommunication
12.7.6. Aerospace and Defense
12.8. Basis Point Share (BPS) Analysis by Applications
12.9. Y-o-Y Growth Projections by Applications
12.10. Market Attractiveness/Growth Potential Analysis
12.10.1. By Country
12.10.2. By Product Type
12.10.3. By Application
12.11. Middle East & Africa Flip Chip Technology Demand Share Forecast, 2019-2026
13. Competition Landscape
13.1. Global Flip Chip Technology Market: Market Share Analysis
13.2. Flip Chip Technology Distributors and Customers
13.3. Flip Chip Technology Market: Competitive Dashboard
13.4. Company Profiles (Details: Overview, Financials, Developments, Strategy)
13.4.1. Samsung Electronics
13.4.2. ASE group
13.4.3. Powertech Technology
13.4.4. United Microelectronics Corporation
13.4.5. Intel Corporation
13.4.6. Amkor Technology
13.4.7. TSMC
13.4.8. Jiangsu Changjiang Electronics Technology
13.4.9. Texas Instruments
13.4.10. Siliconware Precision Industries
Methodology
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