The global barrier films flexible electronics market is projected to expand at a CAGR of 28% during the forecast period, 2021 – 2028. The growth of the market is attributed to advancement of devices in flexible form, which enables efficient performance and offers lightweight, robust nature, and versatility to the device.
Flexible barrier films are a flexible substrate, which prevents or encapsulates electronic components from degradation caused due to water and oxygen. Film capsulation is a method, in which barrier film is produced on polymer substrate and is coated onto the electronic device by pressure sensitive glue. Hybrid encapsulation ensures barrier film application and in-line deposition by using pressure sensitive glue.
Market Trends, Drivers, Restraints, and Opportunities:
The report on the barrier films flexible electronics market includes an assessment of the market, trends, segments, and regional markets. Overview and dynamics have also been included in the report.
Attributes |
Details |
Report Title |
Barrier Films Flexible Electronics Market - Global Industry Analysis, Growth, Share, Size, Trends, and Forecast |
Base Year |
2020 |
Historic Data |
2018–2019 |
Forecast Period |
2021–2028 |
Segmentation |
Products (Flexible Electronics, Photovoltaic, and Others) and Regions |
Regional Scope |
Asia Pacific, North America, Latin America, Europe, and Middle East & Africa |
Report Coverage |
Company Share, Market Analysis and Size, Competitive Landscape, Growth Factors, and Trends, and Revenue Forecast |
Key Players Covered in the Report |
Eastman Chemical Company, General Electric, 3M, Sigma Technologies, Honeywell International Inc., Sigma Technologies Int’l, Alcan Packaging, and Fraunhofer POLO |
Based on products, the global barrier films flexible electronics market is segregated as flexible electronics, photovoltaic, and others. The flexible electronics segment was valued at USD 20,845.0 million in 2018. Growth of the segment is attributed to portability, low cost of production and light weight as compared to rigid substrates. Flexible electronics finds applications in the gaming and entertainment industry, owing to their capability to roll, curve, fold, conform, and flex, allowing a new intuitive user interface.
Samsung is a prominent player in the electronic industry. The company uses barrier films in the display of its S series smartphones, thus boosting the market. Flexible barrier films have helped manufacturers to manufacture flexible displays at a low cost.
The photovoltaic segment is expected to expand at a substantial rate during the forecast period. Rising need for PV systems in residential applications is estimated to boost the market. Government policies in several regions are supporting photovoltaic projects with connections. Photovoltaic installations require skilled workers, such as scholars in R&D and technicians for supporting all aspects of the PV industry.
Less oxygen transmission rate (OTR) and water vapor transmission rate (WVTR) of barrier films are estimated to increase the demand for the product.
On the basis of regions, the global barrier films flexible electronics market is classified as Asia Pacific, North America, Latin America, Europe, and Middle East & Africa. The market in Asia Pacific held a major share of the total revenue in 2018. Growth of the market in the region is attributed to increasing investment and rising demand for electronic devices. Additionally, low capital and labor costs are anticipated to expand the market in the region.
The global barrier films flexible electronics market has been segmented on the basis of
Key players in the global barrier films flexible electronics market include Eastman Chemical Company, General Electric, 3M, Sigma Technologies, Honeywell International Inc., Sigma Technologies Int’l, Alcan Packaging, and Fraunhofer POLO. Manufacturers are investing largely in R&D to discover technologies for reducing emissions & losses and improving efficiency. Partnerships and acquisitions are the major strategies adopted by the vendors for expanding the business.
Fraunhofer Polymer Surface Alliance produced a technology for changing films with a layer system, which is resistant to oxygen and water vapor, without disturbing the optical transparency and flexibility of the film. The technology is founded on the basis of oxide layers deposited by reactive spitting, which is divided by the intermediate polymer layer.
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